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    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    5.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20160196920A1

    公开(公告)日：2016-07-07

    申请号：US15067618

    申请日：2016-03-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： SEIJI KOGA ,  Takashi Omori ,  Jun Ikeda

    IPC: H01G4/12 ,  H01G4/248 ,  H01G4/012 ,  H01G4/30

    CPC classification number: H01G4/1245 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30

    Abstract: A multilayer ceramic electronic component in which an interface of an edge region of an external electrode that extends around to a side surface of a ceramic body and the ceramic configuring a surface of the ceramic body, an inorganic matter is present containing 26 mol % or more and less than 45 mol % of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.154 or more, or an inorganic matter is present containing 45 mol % or more of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.022 or more. Furthermore, the inorganic matter may contain B2O3 having a molar ratio relative to SiO2 within 0.25≦B2O3/SiO2≦0.5.

    Abstract translation: 一种多层陶瓷电子部件，其中外部电极的边缘区域的延伸到陶瓷体侧表面的界面和构成陶瓷体表面的陶瓷，存在含有26摩尔％以上的无机物质的多层陶瓷电子部件 并且摩尔比（TiO 2 + ZrO 2）/（SiO 2 + TiO 2 + ZrO 2）为0.154以上的SiO 2的摩尔比小于45摩尔％，或者含有45摩尔％以上的SiO 2的无机物，摩尔比 （TiO 2 + ZrO 2）/（SiO 2 + TiO 2 + ZrO 2）为0.022以上。 此外，无机物质可以含有相对于SiO 2的摩尔比在0.25＆lt; 1EE; B 2 O 3 / SiO 2和N e E 0.5中的B 2 O 3。

    Multilayer ceramic electronic component
    7.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US09978519B2

    公开(公告)日：2018-05-22

    申请号：US15071646

    申请日：2016-03-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takashi Omori ,  Seiji Koga ,  Jun Ikeda

    IPC: H01G4/228 ,  H01G4/30 ,  H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  H01G4/248

    CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248

    Abstract: A multilayer ceramic electronic component includes a ceramic body having an end surface and a side surface adjacent to thereto such that the end surface and the side surface meet at an edge. The ceramic body has a plurality of internal electrodes with adjacent pairs of the internal electrodes being separated by a respective ceramic layer. An external electrode containing a metal, an inorganic component and voids is electrically connected to at least some of the internal electrodes and both covers the end surface and extends over the edge onto the side surface to form an extending-around portion which extends at least 50 μm onto the side surface as measured in a direction perpendicular to the edge and ends at a leading edge remote from the edge. A portion of the extending-around area which extends 50 μm from the leading edge towards the edge has an average occupancy area ratio which is at least 25 but not greater than 75. The occupancy area ratio is the ratio between the area of the conductive component and an area of the inorganic component on the one hand to the area of the conductive component, the area of the inorganic component and the area of the voids on the other.

    LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    8.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
    层压陶瓷电子元件及其制造方法

    公开(公告)号：US20150279570A1

    公开(公告)日：2015-10-01

    申请号：US14739424

    申请日：2015-06-15

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Seiji Koga ,  Takashi Omori

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  Y10T29/435

    Abstract: An external electrode included in a laminated ceramic electronic component is formed on a ceramic body by baking a conductive paste including a glass component. The ceramic body with the conductive paste applied thereto is subjected to heat treatment under the conditions where the top temperature is 800° C. or higher, and the electromotive force at the top temperature is 600 to 900 mV. In this heat treatment, the glass component in the conductive paste penetrates into grain boundaries between ceramic grains of the ceramic body, and a crystalline substance containing elements constituting the glass component is generated which has dissolving resistance against plating solutions.

    Abstract translation: 包含在层叠陶瓷电子部件中的外部电极通过烘烤包括玻璃成分的导电性糊料形成在陶瓷体上。 在顶部温度为800℃以上的条件下对涂敷有导电性糊料的陶瓷体进行热处理，顶部温度下的电动势为600〜900mV。 在该热处理中，导电性糊剂中的玻璃成分渗透到陶瓷体的陶瓷粒子之间的晶界，产生含有构成玻璃成分的元素的结晶物质，其具有对电镀溶液的耐溶解性。

    MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    单晶陶瓷电子元件及其制造方法

    公开(公告)号：US20150213959A1

    公开(公告)日：2015-07-30

    申请号：US14680492

    申请日：2015-04-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takashi Omori ,  Seiji Koga ,  Jun Ikeda

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/248 ,  H01G4/12 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1209 ,  H01G4/1227 ,  H01G4/2325 ,  H01G4/248

    Abstract: A monolithic ceramic electronic component having outer electrodes that include an inorganic substance containing at least Si, a crystal phase C containing at least Si, Ti, and Ba at the interfaces to a ceramic layer in peripheral end portions of the outer electrodes. A value of the crystal phase area ratio indicating the relationship between the area of the crystal phase C and the area of a glass phase G, which are formed at the interface to the ceramic layer, in a region within 5 μm from the peripheral end portion of the outer electrode is within a range of 75% to 98%.

    Abstract translation: 一种具有外电极的外置电极的整体式陶瓷电子部件，所述外电极包括至少含有Si的无机物质，至少含有Si，Ti和Ba的结晶相C，在与外部电极的外周端部的陶瓷层的界面处。 表示在与陶瓷层的界面形成的晶相C的面积与玻璃相G的面积之间的关系的晶相面积比在距离周边端部5μm以下的区域中的值 为75％〜98％的范围。

    Ceramic Electronic Component
    10.
    发明申请
    Ceramic Electronic Component 有权
    陶瓷电子元件

    公开(公告)号：US20140376155A1

    公开(公告)日：2014-12-25

    申请号：US14484389

    申请日：2014-09-12

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Takashi Omori ,  Seiji Koga

    IPC: H01G4/008 ,  H01G4/228 ,  H01G4/30

    CPC classification number: H01G4/008 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

    Abstract: A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 μm in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 μm to 10 μm. The content of a Si component is 11% by weight or more (preferably 40% by weight or less).

    Abstract translation: 一种陶瓷电子部件，其中外电极放置在陶瓷体的两端部上。 主要包含Ni的第一涂层和包含Sn，焊料等的第二涂层被放置在外电极的表面上。 外电极包括端面部分和侧面翻转部分。 外部电极包括玻璃层，该玻璃层沿着朝向端面部分的方向从侧面翻转部分的覆盖端部以直线距离L设置在至少5μm以下的区域中，以便与 陶瓷体，至少含有Si。 玻璃层的平均厚度t为3μm〜10μm。 Si成分的含量为11重量％以上（优选为40重量％以下）。

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