公开(公告)号：US20130152351A1

公开(公告)日：2013-06-20

申请号：US13767954

申请日：2013-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Makoto OGAWA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA ,  Tatsuo KUNISHI

IPC: H01G4/00

CPC classification number: H01G4/00 ,  C23C18/1632 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/00 ,  C25D1/10 ,  H01G4/232 ,  H01G4/30 ,  H01G13/006 ,  Y10T29/43

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract translation: 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。