公开(公告)号：US20130152351A1

公开(公告)日：2013-06-20

申请号：US13767954

申请日：2013-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Makoto OGAWA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA ,  Tatsuo KUNISHI

IPC: H01G4/00

CPC classification number: H01G4/00 ,  C23C18/1632 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/00 ,  C25D1/10 ,  H01G4/232 ,  H01G4/30 ,  H01G13/006 ,  Y10T29/43

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract translation: 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。

公开(公告)号：US20140049873A1

公开(公告)日：2014-02-20

申请号：US14071684

申请日：2013-11-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

IPC: H01G4/232

CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

公开(公告)号：US20160255725A1

公开(公告)日：2016-09-01

申请号：US15151649

申请日：2016-05-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

IPC: H05K1/18 ,  H01G4/12 ,  H01L41/187 ,  H01C7/00 ,  H01F27/28 ,  H01L41/083 ,  H01G4/30 ,  H01G4/008

CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

公开(公告)号：US20130279073A1

公开(公告)日：2013-10-24

申请号：US13923396

申请日：2013-06-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

IPC: H01G4/30

CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract translation: 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

公开(公告)号：US20140127493A1

公开(公告)日：2014-05-08

申请号：US14154204

申请日：2014-01-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

IPC: H05K1/18 ,  H01F27/28 ,  H01C7/00 ,  H01G4/232 ,  H01L41/083

CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract translation: 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。