公开(公告)号：US20200066449A1

公开(公告)日：2020-02-27

申请号：US16666177

申请日：2019-10-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaki TSUTSUMI ,  Tatsuo KUNISHI

IPC: H01G4/232 ,  H01G4/12 ,  H01G4/30 ,  C25D5/54

Abstract: A method for manufacturing a ceramic electronic component in which a plated electrode can be formed in a region of the surface of a ceramic base body formed of a titanium-containing metal oxide. The method includes preparing a ceramic base body containing a titanium-containing metal oxide, forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser with a peak power density of 1×106 W/cm2 to 1×109 W/cm2 and a frequency of 500 kHz or less, and forming an electrode on the low-resistance section by electroplating. The laser irradiation generates an O defect in a titanium-containing metal oxide, such as BaTiO3 to form an n-type semiconductor. Since this semiconductor section has a lower resistance value than the metal oxide, plating metal can be selectively deposited by electroplating.

公开(公告)号：US20130152351A1

公开(公告)日：2013-06-20

申请号：US13767954

申请日：2013-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Makoto OGAWA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA ,  Tatsuo KUNISHI

IPC: H01G4/00

CPC classification number: H01G4/00 ,  C23C18/1632 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/00 ,  C25D1/10 ,  H01G4/232 ,  H01G4/30 ,  H01G13/006 ,  Y10T29/43

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract translation: 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。

公开(公告)号：US20130141836A1

公开(公告)日：2013-06-06

申请号：US13749741

申请日：2013-01-25

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Junichi SAITO ,  Toshihiko KOBAYASHI ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Kenichi KAWASAKI ,  Tatsuo KUNISHI

IPC: H01G2/10

CPC classification number: H01G2/103 ,  B05D1/38 ,  B05D5/12 ,  B05D7/14 ,  H01G4/224

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract translation: 为了防止水分进入陶瓷电子部件的部件主体的空隙部，至少陶瓷电子部件的部件主体使用防水剂赋予防水性。 将防水剂溶解在超临界流体如超临界CO 2流体中作为溶剂，以至少提供组分主体的防水性。 在提供拒水性之后，除去组分主体外表面上的防水剂。 作为防水剂，可以使用硅烷偶联剂。

公开(公告)号：US20130076203A1

公开(公告)日：2013-03-28

申请号：US13678683

申请日：2012-11-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Junichi SAITO ,  Yoshinori UEDA ,  Tatsuo KUNISHI

IPC: H01G4/12 ,  H01C7/00 ,  H05K1/03 ,  H01F17/00 ,  H01L41/083

CPC classification number: H01G4/12 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/292 ,  H01G4/005 ,  H01G4/30 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/273 ,  H05K1/0306

Abstract: A ceramic body including therein conductors more effectively prevents ingress of moisture into voids between the conductors and the ceramic body. A supercritical fluid containing a monomer flows in the voids between internal electrode layers and a ceramic laminated body. Then, the voids between the internal electrode layers and the ceramic laminated body are filled with a polymer by the polymerization of the monomer.

Abstract translation: 其中包括导体的陶瓷体更有效地防止水分进入导体和陶瓷体之间的空隙。 含有单体的超临界流体流入内部电极层和陶瓷层叠体之间的空隙。 然后，通过单体的聚合，用聚合物填充内部电极层和陶瓷层叠体之间的空隙。