公开(公告)号：US20160157354A1

公开(公告)日：2016-06-02

申请号：US15015475

申请日：2016-02-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Yuki WAKABAYASHI ,  Kuniaki YOSUI ,  Yuki ITO ,  Toshiro ADACHI ,  Wataru YANASE ,  Masaki KAWATA

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/186 ,  H05K3/4682 ,  H05K2201/09072 ,  H05K2203/0278

Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

Abstract translation: 部件嵌入式基板包括层叠体和电子部件。 电子部件嵌入在层压板中。 层压体包括框状导体图案。 当在层叠方向上观察层压体时，框状导体图形被布置成基本上围绕电子部件的整个周边。 框状导体图案包括第一单独导体图案和第二单独导体图案。 第一单独导体图案和第二单独导体图案彼此分离。 第一单独导体图案布置成靠近电子部件的第一外部端子电极，并且第二单独导体图案布置成靠近电子部件的第二外部端子电极。