公开(公告)号：US20160157354A1

公开(公告)日：2016-06-02

申请号：US15015475

申请日：2016-02-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Yuki WAKABAYASHI ,  Kuniaki YOSUI ,  Yuki ITO ,  Toshiro ADACHI ,  Wataru YANASE ,  Masaki KAWATA

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/186 ,  H05K3/4682 ,  H05K2201/09072 ,  H05K2203/0278

Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

Abstract translation: 部件嵌入式基板包括层叠体和电子部件。 电子部件嵌入在层压板中。 层压体包括框状导体图案。 当在层叠方向上观察层压体时，框状导体图形被布置成基本上围绕电子部件的整个周边。 框状导体图案包括第一单独导体图案和第二单独导体图案。 第一单独导体图案和第二单独导体图案彼此分离。 第一单独导体图案布置成靠近电子部件的第一外部端子电极，并且第二单独导体图案布置成靠近电子部件的第二外部端子电极。

公开(公告)号：US20200013538A1

公开(公告)日：2020-01-09

申请号：US16575565

申请日：2019-09-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiro ADACHI ,  Masataka NAKANIWA

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

Abstract: A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.

公开(公告)号：US20180368254A1

公开(公告)日：2018-12-20

申请号：US16109915

申请日：2018-08-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiro ADACHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H05K1/0313 ,  H05K1/092 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/4038 ,  H05K3/46 ,  H05K3/4644 ,  H05K2201/068 ,  H05K2201/095

Abstract: A resin substrate includes a first portion including a plurality of resin sheets provided at one end in a stacking direction and a second portion including a plurality of resin sheets provided at the other end in the stacking direction. The thickness of the plurality of resin sheets is the same or substantially the same as the thickness of the first portion and the second portion. The density of planar conductor patterns of the first portion with respect to the volume of the first portion is lower than the density of planar conductor patterns of the second portion with respect to the volume of the second portion. The average of the diameters of the first interlayer connection conductor provided in the first portion is greater than the average of the diameters of the second interlayer connection conductor provided in the second portion.

公开(公告)号：US20180213643A1

公开(公告)日：2018-07-26

申请号：US15935249

申请日：2018-03-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiro ADACHI ,  Kuniaki YOSUI

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K3/06

Abstract: A resin multilayer substrate includes a first resin layer including a thermoplastic resin as a main material, a second resin layer including the thermoplastic resin as a main material and superposed on the first resin layer, a first interlayer-connection conductor passing through the first resin layer in a thickness direction, and a first conductor pattern at an area including a region in which the first interlayer-connection conductor is exposed at the surface of the first resin layer between the first resin layer and the second resin layer. The first conductor pattern includes a portion in or at which a portion of the first interlayer-connection conductor is disposed. The first conductor pattern includes a first portion covering the region exposed at the surface of the first resin layer; and a second portion disposed surrounding the first portion. The first portion and the second portion have different thicknesses from each other.

公开(公告)号：US20170176392A1

公开(公告)日：2017-06-22

申请号：US15446092

申请日：2017-03-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Toshiro ADACHI

IPC: G01N29/04 ,  G01N29/11 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L23/552

CPC classification number: G01N29/043 ,  G01N29/11 ,  G01N2291/015 ,  G01N2291/048 ,  G01N2291/2697 ,  H01L23/00 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3512 ,  H05K1/0218 ,  H05K1/0269 ,  H05K1/185 ,  H05K2203/0285

Abstract: A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.