公开(公告)号：US20250055176A1

公开(公告)日：2025-02-13

申请号：US18930062

申请日：2024-10-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori YAMAWAKI ,  Noboru KATO ,  Ryosuke WASHIDA ,  Yoichi SAITO ,  Masaki KASAI

IPC: H01Q1/22 ,  H01Q1/02 ,  H01Q9/06

Abstract: An electronic component module includes a first substrate, a coupling electrode and a second substrate. The coupling electrode is provided on a first surface of the first substrate, the coupling electrode is configured to be electromagnetically coupled with a conductor pattern on an antenna member. The second substrate is provided on the first surface of the first substrate, the second substrate covers the coupling electrode. A first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate.

公开(公告)号：US20240188271A1

公开(公告)日：2024-06-06

申请号：US18440272

申请日：2024-02-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori YAMAWAKI ,  Ryosuke WASHIDA ,  Noboru KATO

IPC: H05K13/04 ,  B32B37/22 ,  H04B1/3827

CPC classification number: H05K13/0469 ,  B32B37/22 ,  H04B1/3827 ,  H05K13/0404

Abstract: A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

公开(公告)号：US20230033357A1

公开(公告)日：2023-02-02

申请号：US17964975

申请日：2022-10-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori YAMAWAKI ,  Noboru KATO ,  Ryosuke WASHIDA

IPC: B65H23/24 ,  H01Q1/22 ,  B65H20/24

Abstract: A wireless communication device manufacturing system is provided that includes a conveyor that conveys an antenna base material in a manner passing through a mounting position, a mounter that mounts an RFIC module on the antenna base material with an insulating adhesive layer interposed therebetween, a roller pair that nips the antenna base material having the RFIC module mounted thereon in a thickness direction of the antenna base material and presses the RFIC module against the adhesive layer, a first dancer roller freely movably placed on the antenna base material on an upstream side of the mounter, and a second dancer roller freely movably placed on the antenna base material on a downstream side of the roller pair. Moreover, each of the first and second dancer rollers includes a cylindrical portion placed on the antenna base material and locking portions provided at respective ends of the cylindrical portion.

公开(公告)号：US20230267297A1

公开(公告)日：2023-08-24

申请号：US18309117

申请日：2023-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori YAMAWAKI ,  Noboru KATO ,  Ryosuke WASHIDA ,  Yoshiki ABURATANI

IPC: G06K19/077 ,  H05K13/04 ,  H05K3/34

CPC classification number: G06K19/077 ,  H05K13/04 ,  H05K3/341

Abstract: A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.

公开(公告)号：US20220242081A1

公开(公告)日：2022-08-04

申请号：US17660112

申请日：2022-04-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori YAMAWAKI ,  Noboru KATO ,  Ryosuke WASHIDA

IPC: B31D1/02 ,  G06K19/077 ,  G06K1/12 ,  B31D1/00

Abstract: An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.