公开(公告)号：US20210265555A1

公开(公告)日：2021-08-26

申请号：US17317358

申请日：2021-05-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takafumi KUSUYAMA ,  Yoshitaka ECHIKAWA

IPC: H01L41/047 ,  H01L23/31 ,  H01L23/538

Abstract: A board has a first main surface and a second main surface. A first electronic component is mounted on a board so that one surface on which an electrical functional unit is formed faces a first main surface. A second electronic component is mounted on the board so that one surface on which an electrical functional unit is formed faces a second main surface. At least a portion of the first electronic component and at least a portion of the second electronic component overlap each other in a plan view. The other surface of the first electronic component is exposed from a mold resin. The other surface of the second electronic component is exposed from a mold resin.

公开(公告)号：US20220304201A1

公开(公告)日：2022-09-22

申请号：US17806290

申请日：2022-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Takafumi KUSUYAMA

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/11

Abstract: A module includes a main substrate having a first surface, a sub-module mounted on the first surface, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface, the sub-module, and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shielding film formed so as to cover at least a part of a surface of second sealing resin remote from the first surface. A surface of the sub-module remote from the first surface includes a striped section where an area covered with the internal shielding film and an area where the second sealing resin is exposed are alternately arranged.

公开(公告)号：US20210043585A1

公开(公告)日：2021-02-11

申请号：US17077125

申请日：2020-10-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Takafumi KUSUYAMA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56

Abstract: A high frequency module in which warpage does not easily occur is provided by adjusting linear expansion coefficient, glass transition temperature, and elastic modulus of a sealing resin layer. The high frequency module includes a wiring board, a first component mounted on a lower surface of the wiring board, a plurality of connection terminals, a first sealing resin layer that coats the first component and the connection terminal, a plurality of second components mounted on an upper surface of the wiring board, a second sealing resin layer coating the second components, and a shield film. The first sealing resin layer is formed thinner than the second sealing resin layer, and the first sealing resin layer has the linear expansion coefficient of the resin smaller than the linear expansion coefficient of the resin of the second sealing resin layer.

公开(公告)号：US20220028750A1

公开(公告)日：2022-01-27

申请号：US17498389

申请日：2021-10-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Motohiko KUSUNOKI ,  Osamu YAMAGUCHI ,  Shinichiro BANBA ,  Takafumi KUSUYAMA

IPC: H01L23/29 ,  H01L23/40 ,  H01L23/552 ,  H01L25/18 ,  H01L23/367 ,  H01L25/07

Abstract: An electronic component module is provided that includes a substrate, an electronic component, a heat dissipating member, and a sealing resin. The electronic component is mounted on the substrate. The heat dissipating member includes a flat plate and columnar bodies. The sealing resin covers a side of a first main surface of the substrate and the electronic component. Moreover, the heat dissipating member, except for a top surface of the flat plate, is covered with the sealing resin. The columnar bodies are disposed at an outer peripheral of the flat plate, and have a shape protruding from a bottom surface of the flat plate. The columnar bodies include a root connected to the flat plate, and a tip connected to the substrate. In a plan view of the electronic component module, the tip is not outside the root.

公开(公告)号：US20210159133A1

公开(公告)日：2021-05-27

申请号：US17142611

申请日：2021-01-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi AIKAWA ,  Takafumi KUSUYAMA

IPC: H01L23/14 ,  H01L23/31 ,  H01L23/66 ,  H01L23/498 ,  H01L25/18

Abstract: A circuit module includes a first wiring substrate having a first main surface and a plurality of first components mounted on the first main surface. The plurality of first components includes a multilayer component formed as a single chip by being sealed using resin members. The multilayer component includes a second wiring substrate having a second main surface and a third main surface that face each other, a second component mounted on the second main surface, and a third component mounted on the third main surface.

公开(公告)号：US20230103130A1

公开(公告)日：2023-03-30

申请号：US18062176

申请日：2022-12-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Takafumi KUSUYAMA

IPC: H05K1/18 ,  H05K1/11

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.

公开(公告)号：US20200008301A1

公开(公告)日：2020-01-02

申请号：US16565912

申请日：2019-09-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takafumi KUSUYAMA

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/10 ,  H05K3/38

Abstract: A circuit module includes a substrate on which a first electrode and a second electrode are provided, a first electronic component, and a first resin layer. The first electrode includes a first electrode base body and a first plating film. The second electrode and the first electronic component are covered with the first resin layer. The second electrode includes a second electrode base body, a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side relative to an outer surface of the first resin layer, a second plating film with a cylindrical shape covering a side surface of a connection body of the second electrode base body and the metal column, and a covering portion connected to the other end of the metal column.

公开(公告)号：US20230120573A1

公开(公告)日：2023-04-20

申请号：US18069334

申请日：2022-12-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takafumi KUSUYAMA ,  Hiroshi KIKUCHI ,  Masanori YOSHIKAWA

IPC: H01G9/26 ,  H01G9/048 ,  H01G9/07

Abstract: The capacitor array that includes: a capacitor layer including a plurality of capacitor portions divided by a plurality of through-portions and arranged in a plane, and the capacitor portions each have a first main surface and a second main surface that are opposite to each other in a thickness direction. The plurality of through-portions include a first through-portion extending in a first direction perpendicular to the thickness direction, and a second through-portion extending in a second direction perpendicular to the thickness direction and intersecting the first direction. In a sectional view, each of the first through-portion and the second through-portion independently has a taper having a width decreasing from one of the first main surface and the second main surface to the other main surface. The first through-portion has a taper angle that is different from a taper angle of the second through-portion.

公开(公告)号：US20220320008A1

公开(公告)日：2022-10-06

申请号：US17807930

申请日：2022-06-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takafumi KUSUYAMA ,  Tadashi NOMURA ,  Yoshihito OTSUBO

IPC: H01L23/552 ,  H01L25/10

Abstract: A module includes a main board including a first surface, a submodule mounted on the first surface, a first component mounted on the first surface separately from the submodule, a first sealing resin formed so as to cover the first surface, the submodule, and the first component, and an external shield film formed so as to cover a surface and a side surface of the first sealing resin on a side far from the first surface and a side surface of the main board. The submodule includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shield film formed so as to cover at least a part of a side surface of the second sealing resin. The internal shield film has at least a two-layer structure.

公开(公告)号：US20220320007A1

公开(公告)日：2022-10-06

申请号：US17806769

申请日：2022-06-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Takafumi KUSUYAMA

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: A module includes a main substrate, a sub-module mounted on a first surface of the main substrate, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an inner shield film formed so as to cover at least a part of side surfaces of the second sealing resin and not to electrically connect to the main substrate. A ground connection conductor is disposed so as to electrically connect to the inner shield film, and the ground connection conductor is exposed to the outside.