公开(公告)号：US11763994B2

公开(公告)日：2023-09-19

申请号：US17666605

申请日：2022-02-08

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuichiro Tanaka

IPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12

CPC分类号： H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218

摘要： In a multilayer ceramic capacitor, a proportion of a glass component in a first side surface-side base electrode layer is about 60% or more in a first range from a tip in a vicinity of a second end surface of the first side surface-side base electrode layer to a position of a length which is about 10% of a dimension in a length direction of the first side surface-side base electrode layer, and a proportion of a glass component in a second side surface-side base electrode layer is about 60% or more in a second range from a tip in a vicinity of a first end surface of the second side surface-side base electrode layer to a position of a length which is about 10% of a dimension in a length direction of the second side surface-side base electrode layer.

公开(公告)号：US12051547B2

公开(公告)日：2024-07-30

申请号：US18124620

申请日：2023-03-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuichiro Tanaka ,  Hiroki Awata

IPC分类号： H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/18

CPC分类号： H01G4/2325 ,  H01G4/248 ,  H05K1/185 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651

摘要： A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

公开(公告)号：US12080483B2

公开(公告)日：2024-09-03

申请号：US17398051

申请日：2021-08-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuichiro Tanaka ,  Hiroki Awata

IPC分类号： H01G4/30 ,  B32B18/00 ,  B32B37/10 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC分类号： H01G4/30 ,  B32B18/00 ,  B32B37/10 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1209 ,  B32B2457/16

摘要： A method of producing a multilayer ceramic electronic component includes a lamination step of producing a laminate by laminating green sheets each with an internal electrode layer formed thereon, an isotropic pressing step of subjecting the laminate to isotropic pressing, a flattening step of shaving one or both of main surfaces of the isotropic pressed laminate to flatten the one or both of the main surfaces of the laminate, and a rigid pressing step of pressing the flattened laminate from both of the main surfaces with a rigid body on each of the main surfaces.

公开(公告)号：US11646157B2

公开(公告)日：2023-05-09

申请号：US17383485

申请日：2021-07-23

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuichiro Tanaka ,  Hiroki Awata

IPC分类号： H01G4/232 ,  H05K1/18 ,  H01G4/30

CPC分类号： H01G4/2325 ,  H05K1/185 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/10651

摘要： A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

公开(公告)号：US10340081B2

公开(公告)日：2019-07-02

申请号：US15607767

申请日：2017-05-30

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuichiro Tanaka

IPC分类号： H01G4/12 ,  H01G4/30 ,  C23C14/18 ,  C23C14/34 ,  H01G4/005 ,  H01G4/232

摘要： A ceramic capacitor which is low in ESL and suitable for being built into a substrate includes a first external electrode, a second external electrode and a third external electrode. Each of the first, second and third external electrodes include a sputtering electrode film. Each of the outermost layers of the first, second and third external electrodes contains Cu.