公开(公告)号：US20200043866A1

公开(公告)日：2020-02-06

申请号：US16601777

申请日：2019-10-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro FUJII ,  Yuta MORIMOTO

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/31

Abstract: The present disclosure enables a component to operate stably by making it unlikely that the component will be affected by unwanted electromagnetic waves generated by another component. A module includes: a substrate; a first component and a second component that are mounted on one main surface of the substrate; a sealing resin layer that seals the first component and the second component; and a shield layer that covers part of the sealing resin layer. A recess is formed in the sealing resin layer toward the one main surface from a surface including an upper surface of the sealing resin layer between the first component and the second component in a plan view from a direction perpendicular to the one main surface. The shield layer is not provided in the recess of the sealing resin layer.

公开(公告)号：US20200337187A1

公开(公告)日：2020-10-22

申请号：US16919949

申请日：2020-07-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Yuta MORIMOTO

IPC: H05K9/00 ,  H01L23/12 ,  H01L23/66 ,  H01L23/31 ,  H05K1/02 ,  H05K3/28

Abstract: A high-frequency module 1a includes a multilayer wiring substrate 2, a plurality of components 3a, 3b mounted on an upper surface 20a of the multilayer wiring substrate 2, a sealing resin layer 4 laminated on the upper surface 20a of the multilayer wiring substrate 2 and sealing the plurality of components 3a, 3b, and a shield 5. The shield 5 is composed of shield walls 5a, 5b arranged in grooves 12 and 13, respectively, formed between the first component 3a and the second component 3b in the sealing resin layer 4 and a connecting conductor 11 coupling both the shield walls 5a, 5b. A first region 40a and a second region 40b in the sealing resin layer 4 split by the shield 5 are contiguous at the location of the connecting conductor 11 as seen from a direction perpendicular to the upper surface 20a of the multilayer wiring substrate 2.

公开(公告)号：US20200303813A1

公开(公告)日：2020-09-24

申请号：US16896378

申请日：2020-06-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuta MORIMOTO ,  Issei YAMAMOTO

IPC: H01Q1/40

Abstract: An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.

公开(公告)号：US20180166394A1

公开(公告)日：2018-06-14

申请号：US15892504

申请日：2018-02-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Yoshihisa MASUDA ,  Hideo NAKAGOSHI ,  Yuta MORIMOTO ,  Norio SAKAI ,  Yoriyuki MATSUMOTO ,  Hiroaki TSUCHIDA

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/13 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/66

Abstract: The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.

公开(公告)号：US20210259104A1

公开(公告)日：2021-08-19

申请号：US17308250

申请日：2021-05-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoya MURAKITA ,  Yoshihito OTSUBO ,  Issei YAMAMOTO ,  Yuta MORIMOTO

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11

Abstract: A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.