公开(公告)号：US20090230548A1

公开(公告)日：2009-09-17

申请号：US12193835

申请日：2008-08-19

申请人： Myeong-soon PARK ,  Hyun-soo CHUNG ,  Seok-ho KIM ,  Ki-hyuk KIM ,  Chang-woo SHIN

发明人： Myeong-soon PARK ,  Hyun-soo CHUNG ,  Seok-ho KIM ,  Ki-hyuk KIM ,  Chang-woo SHIN

IPC分类号： H01L23/49

CPC分类号： H01L25/0657 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/731 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may have a semiconductor chip that includes a chip pad formed on a substrate including an integrated circuit, and a passivation layer exposing the chip pad, a first redistribution wiring layer that is connected to the chip pad and extends on the semiconductor chip and includes a wire bonding pad to provide wire bonding and a first solder pad to connect the first redistribution wiring layer to a second semiconductor chip, and a second redistribution wiring layer that is connected to the first redistribution wiring layer on the first redistribution wiring layer and includes a second solder pad to connect the second redistribution wiring layer to a third semiconductor chip.

摘要翻译： 半导体封装可以具有半导体芯片，其包括形成在包括集成电路的基板上的芯片焊盘和暴露芯片焊盘的钝化层，连接到芯片焊盘并在半导体芯片上延伸的第一再分配布线层，以及 包括用于提供引线接合的引线接合焊盘和将第一再分配布线层连接到第二半导体芯片的第一焊盘，以及连接到第一再分布布线层上的第一再分布布线层的第二再分布布线层， 第二焊盘，用于将第二再分配布线层连接到第三半导体芯片。

公开(公告)号：US20090161979A1

公开(公告)日：2009-06-25

申请号：US12257721

申请日：2008-10-24

申请人： Seok-ho KIM

发明人： Seok-ho KIM

IPC分类号： G06K9/40 ,  H04N5/228

CPC分类号： H04N5/272 ,  H04N1/407 ,  H04N1/409

摘要： An image acquiring apparatus includes: an image sensor which senses light reflected from an object to be read, and which detects an analog pixel value corresponding to the sensed reflected light; and a compensator which compensates the analog pixel value in its analog form for removing a background of the object contemporaneously as the object is being read in line(s).

摘要翻译： 图像获取装置包括：感测从要读取的对象反射的光并且检测与所感测的反射光相对应的模拟像素值的图像传感器; 以及补偿器，其补偿其模拟形式的模拟像素值，用于当对象正在被读取时同时移除对象的背景。