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公开(公告)号：US20080314633A1
公开(公告)日：2008-12-25
申请号：US12149522
申请日：2008-05-02
申请人： Myung Sam Kang , Chin Kwan Kim
发明人： Myung Sam Kang , Chin Kwan Kim
IPC分类号： H01R12/04
CPC分类号： H05K3/4007 , H05K3/246 , H05K3/3457 , H05K3/4069 , H05K2201/0347 , H05K2201/0367 , H05K2201/0376 , H05K2201/09481 , H05K2201/09745
摘要： A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.
摘要翻译： 公开了一种印刷电路板，其增加了IC和印刷电路板之间的接触面积，从而增加了粘合度。 印刷电路板包括：绝缘层，其包括嵌入在绝缘层的上表面中以与上表面齐平的至少一个通孔焊盘的第一电路图案，以及形成在下表面中的第二电路图案 的绝缘层与下表面齐平; 形成在绝缘层上的阻焊层; 通孔和通过通孔和通孔焊盘一体地形成在第二电路图案上的突起，使得其从绝缘层突出成高于阻焊层。
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公开(公告)号：US08080741B2
公开(公告)日：2011-12-20
申请号：US12149522
申请日：2008-05-02
申请人： Myung Sam Kang , Chin Kwan Kim
发明人： Myung Sam Kang , Chin Kwan Kim
IPC分类号： H05K1/11
CPC分类号： H05K3/4007 , H05K3/246 , H05K3/3457 , H05K3/4069 , H05K2201/0347 , H05K2201/0367 , H05K2201/0376 , H05K2201/09481 , H05K2201/09745
摘要： A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.
摘要翻译： 公开了一种印刷电路板，其增加了IC和印刷电路板之间的接触面积，从而增加了粘合度。 印刷电路板包括：绝缘层，其包括嵌入在绝缘层的上表面中以与上表面齐平的至少一个通孔焊盘的第一电路图案，以及形成在下表面中的第二电路图案 的绝缘层与下表面齐平; 形成在绝缘层上的阻焊层; 通孔和通过通孔和通孔焊盘一体地形成在第二电路图案上的突起，使得其从绝缘层突出成高于阻焊层。
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公开(公告)号：US20110286191A1
公开(公告)日：2011-11-24
申请号：US12926337
申请日：2010-11-10
申请人： Byoung Chan Kim , Young Hwan Shin , Chin Kwan Kim , Dong Won Kim , Kui Won Kang
发明人： Byoung Chan Kim , Young Hwan Shin , Chin Kwan Kim , Dong Won Kim , Kui Won Kang
IPC分类号： H05K7/06
CPC分类号： H01L23/49816 , H01L21/563 , H01L24/32 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83385 , H01L2224/92125 , H01L2924/15311 , H01L2924/15787 , H01L2924/00012 , H01L2924/00
摘要： Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.
摘要翻译： 这里公开了一种印刷电路板。 印刷电路板包括：基底基板，其包括安装有半导体芯片的第一区域和位于第一区域外部的第二区域;覆盖基底基板并且包括形成在第二区域上的沟槽的第一绝缘图案，以及第二绝缘图案突出 从第二区域上的第一绝缘图案。 在形成底部填充剂的过程中，沟槽和第二绝缘图案可以用作限定形成预处理形状的底部填充材料的结构。
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公开(公告)号：US08253034B2
公开(公告)日：2012-08-28
申请号：US12926337
申请日：2010-11-10
申请人： Byoung Chan Kim , Young Hwan Shin , Chin Kwan Kim , Dong Won Kim , Kui Won Kang
发明人： Byoung Chan Kim , Young Hwan Shin , Chin Kwan Kim , Dong Won Kim , Kui Won Kang
CPC分类号： H01L23/49816 , H01L21/563 , H01L24/32 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83385 , H01L2224/92125 , H01L2924/15311 , H01L2924/15787 , H01L2924/00012 , H01L2924/00
摘要： Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.
摘要翻译： 这里公开了一种印刷电路板。 印刷电路板包括：基底基板，其包括安装有半导体芯片的第一区域和位于第一区域外部的第二区域;覆盖基底基板并且包括形成在第二区域上的沟槽的第一绝缘图案，以及第二绝缘图案突出 从第二区域上的第一绝缘图案。 在形成底部填充剂的过程中，沟槽和第二绝缘图案可以用作限定形成预处理形状的底部填充材料的结构。
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