公开(公告)号：US11848659B2

公开(公告)日：2023-12-19

申请号：US16651833

申请日：2018-09-28

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki Hashimoto ,  Takuya Ishibashi ,  Hiroyuki Okada ,  Kazuki Nishimura

IPC: H03H9/10 ,  B29C51/12 ,  B29C51/14 ,  B32B27/08 ,  H03H9/05 ,  H05K3/28 ,  H10N30/02 ,  H10N30/88 ,  H10N30/87 ,  B29K101/10 ,  B29L31/34

CPC classification number: H03H9/1085 ,  B29C51/12 ,  B29C51/14 ,  B32B27/08 ,  H03H9/059 ,  H05K3/284 ,  H10N30/02 ,  H10N30/875 ,  H10N30/88 ,  H10N30/883 ,  B29K2101/10 ,  B29L2031/34 ,  Y10T29/49146

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.

公开(公告)号：US11799442B2

公开(公告)日：2023-10-24

申请号：US16650709

申请日：2018-09-28

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki Hashimoto ,  Takuya Ishibashi ,  Kazuki Nishimura

IPC: H01L23/373 ,  H03H9/08 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H10N30/02 ,  H10N30/88 ,  H10N30/088 ,  H10N30/87

CPC classification number: H03H9/08 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H10N30/02 ,  H10N30/088 ,  H10N30/875 ,  H10N30/88

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet. The first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than that in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than that in a thickness direction.

公开(公告)号：US11410898B2

公开(公告)日：2022-08-09

申请号：US16760092

申请日：2018-10-30

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki Hashimoto ,  Takuya Ishibashi ,  Kazuki Nishimura

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/31

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member via bumps, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a sheet having a space maintaining layer; a disposing step of disposing the sheet on the mounting member such that the space maintaining layer faces the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members so as to maintain the space, and to cure the sheet. The bumps are solder bumps. The space maintaining layer after curing has a glass transition temperature of higher than 125° C., and a coefficient of thermal expansion at 125° C. or lower of 20 ppm/K or less.