PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
    1.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号:US20160205782A1

    公开(公告)日:2016-07-14

    申请号:US14701264

    申请日:2015-04-30

    Abstract: A printed circuit board is provided, including a products area, an outline area, a plurality of cutting channels, and at least one measurement unit. The products area includes a plurality of circuit board units arranged in a matrix, and each of the circuit board units has a plurality of first internal wiring layers. The outline area surrounds the products area. The cutting channels are located between the outline area and the circuit board units, and between the circuit board units. The measurement unit is disposed in one of the cutting channels and has a plurality of second internal wiring layers and a plurality of contact pads. The second internal wiring layers and the first internal wiring layers are formed by the same fabrication processes. The contact pads are electrically connected to the second internal wiring layers and exposed to a surface of the printed circuit board.

    Abstract translation: 提供一种印刷电路板,包括产品区域,轮廓区域,多个切割通道和至少一个测量单元。 产品区域包括以矩阵形式布置的多个电路板单元,并且每个电路板单元具有多个第一内部布线层。 轮廓区域围绕产品区域。 切割通道位于轮廓区域和电路板单元之间,以及电路板单元之间。 测量单元设置在一个切割通道中,并且具有多个第二内部布线层和多​​个接触垫。 第二内部布线层和第一内部布线层通过相同的制造工艺形成。 接触焊盘电连接到第二内部布线层并暴露于印刷电路板的表面。

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