公开(公告)号：US20230407146A1

公开(公告)日：2023-12-21

申请号：US17865291

申请日：2022-07-14

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Chun-Che Tsao ,  Cheng-Hung Chen

IPC: C09J9/02 ,  C09J7/24 ,  C09J123/02

CPC classification number: C09J9/02 ,  C09J7/243 ,  C09J123/025 ,  C09J2203/326 ,  C09J2301/314 ,  C09J2301/416 ,  C09J2423/046

Abstract: A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9Ω, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.

公开(公告)号：US11518150B2

公开(公告)日：2022-12-06

申请号：US17022261

申请日：2020-09-16

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Chun-Che Tsao ,  Cheng-Hung Chen

IPC: B32B27/08 ,  B32B27/36 ,  B32B27/40 ,  B32B7/12 ,  C08J3/22 ,  B32B7/06 ,  B29C48/18 ,  B32B27/32

Abstract: A release liner and a method for producing the same are provided. The release liner includes a resin base layer and two resin release layers. The resin base layer has two surfaces opposite to each other. The two resin release layers are respectively formed on the two surfaces of the resin base layer. Each of the resin release layers includes: a non-polar resin material and a polar resin material. In each of the resin release layers, the polar resin material is dispersed in the non-polar resin material in a plurality of granular forms, an average particle size of the polar resin material ranges from 0.1 μm to 10 μm, and a content of the polar resin material in the resin release layer ranges from 10 wt % to 50 wt %, so that a surface roughness (Ra) of the resin release layer ranges from 0.1 μm to 10 μm.

公开(公告)号：US11958996B2

公开(公告)日：2024-04-16

申请号：US17865291

申请日：2022-07-14

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Chun-Che Tsao ,  Cheng-Hung Chen

IPC: C09J9/02 ,  C09J7/24 ,  C09J123/02

CPC classification number: C09J9/02 ,  C09J7/243 ,  C09J123/025 ,  C09J2203/326 ,  C09J2301/314 ,  C09J2301/416 ,  C09J2423/046

Abstract: A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9Ω, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.

公开(公告)号：US12172812B2

公开(公告)日：2024-12-24

申请号：US17871977

申请日：2022-07-24

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Chun-Che Tsao ,  Cheng-Hung Chen

IPC: C23C14/00 ,  B65D65/42 ,  C08J7/048 ,  C23C14/08 ,  C23C14/10 ,  C23C14/26 ,  C23C14/30

Abstract: A food packaging barrier film and a method for producing the same are provided. The method includes providing a base film, depositing an inorganic laminated film on a surface of the base film, and coating a barrier coating solution on the inorganic laminated film and then curing the barrier coating solution to form a barrier coating layer. The inorganic laminated film includes at least one first inorganic material deposition layer and a second inorganic material deposition layer stacked upon each other, and the at least one first inorganic material deposition layer and the second inorganic material deposition layer are formed in a same vacuum deposition process and in a vacuum condition. The at least one first inorganic material deposition layer and the second inorganic material deposition layer are respectively formed by different inorganic metal oxides in the same vacuum depositing process.