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公开(公告)号:US20180051116A1
公开(公告)日:2018-02-22
申请号:US15673798
申请日:2017-08-10
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao LIAO , Ying-Te HUANG , Hao-Sheng CHEN , Hung-Yi CHANG , Chuan CHOU , Jui-Jung LIN LAI
IPC: C08F283/08
CPC classification number: C08F283/08 , C08F6/06 , C08F8/02 , C08L65/02
Abstract: A process for producing a modified polyphenylene ether resin having a purity of more than 99.4%, comprising steps of graft modification, water rinse, and extraction as well as phase splitting, is disclosed that step of separating out powder during purification is no needed, and the solvent for use in performing dissolving of or/and extraction of polyphenylene ether resin can be recycled for future use, so that the manufacturing process is simple and uses less solvent as compared to the prior art, and further helps to conserve resources and is environmentally friendly.
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公开(公告)号:US20170183551A1
公开(公告)日:2017-06-29
申请号:US15384618
申请日:2016-12-20
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao LIAO , Cheng-Li CHAO , Chuan CHOU , Yung-Sheng WANG
IPC: C09J175/08 , C08G18/73 , C08G18/36 , C09J7/02 , C08G18/44 , C08G18/66 , C09J5/00 , C08G18/83 , C08G18/42
CPC classification number: C09J175/08 , C08G18/36 , C08G18/4018 , C08G18/4238 , C08G18/44 , C08G18/61 , C08G18/6662 , C08G18/73 , C08G18/792 , C08G18/837 , C08G2170/40 , C09J5/00 , C09J7/22 , C09J7/38 , C09J2451/00 , C09J2467/006 , C09J175/04 , C08K5/0075 , C08K5/103
Abstract: A polyurethane adhesive is formulated using a modified polyurethane copolymer, a curing agent and an antistatic agent, and the modified polyurethane copolymer is grafted a polysiloxane compound to a polyurethane polymer and made by esterifying a polyol, a hydroxyl-containing polysiloxane compound, a multi-functional isocyanate compound and a fatty acid ester; since the polyurethane adhesive is not yellowish and easy to dry as well as has excellent fabricability, air bleeding performance and transparency, when attached to surfaces of an optical or electronic device, the protective film leaves no residue and protects the surface of the device keeping no flaws.
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