CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING THE SAME

    公开(公告)号:US20250137155A1

    公开(公告)日:2025-05-01

    申请号:US18393585

    申请日:2023-12-21

    Abstract: A carrier-attached ultra-thin copper foil and a method for producing the same are provided. The carrier-attached ultra-thin copper foil includes a copper foil carrier, a release layer, and an ultra-thin copper foil layer. The release layer is formed on a side surface of the copper foil carrier. The release layer contains a copper-containing organic compound, and a chemical structure of the copper-containing organic compound has at least a copper-nitrogen bond (Cu—N bond). The ultra-thin copper foil layer is formed on a side surface of the release layer away from the copper foil carrier. The copper foil carrier is capable of being separated from the ultra-thin copper foil layer through the release layer.

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