Abstract:
A carrier-attached ultra-thin copper foil and a method for producing the same are provided. The carrier-attached ultra-thin copper foil includes a copper foil carrier, a release layer, and an ultra-thin copper foil layer. The release layer is formed on a side surface of the copper foil carrier. The release layer contains a copper-containing organic compound, and a chemical structure of the copper-containing organic compound has at least a copper-nitrogen bond (Cu—N bond). The ultra-thin copper foil layer is formed on a side surface of the release layer away from the copper foil carrier. The copper foil carrier is capable of being separated from the ultra-thin copper foil layer through the release layer.
Abstract:
A transparent heat-shielding material having a chemical formula CsXNYWO3-ZClC, characterized by being co-doped with elements of different groups in the periodic table, wherein Cs is cesium; N is tin (Sn) or antimony (Sb) or bismuth (Bi); W is tungsten; O is oxygen; and X, Y, Z, and C are positive numbers satisfying the following conditions: X≦1.0, Y≦1.0, Y/X≦1.0, Z≦0.6, and C≦0.1; the transparent heat-shielding material is used to make a highly transparent and highly effective heat-shielding film which can be adhered to glass panels of buildings and automobiles to block infrared radiation in the wavelength range of 800-2000 nm, thereby insulating heat and saving energy; and the film is also applicable as a composite substrate for electronic components.