公开(公告)号：US20140124929A1

公开(公告)日：2014-05-08

申请号：US14074697

申请日：2013-11-07

申请人： NANTONG FUJITSU MICROELECTRONICS CO., LTD.

发明人： CHANG-MING LIN ,  Lei SHI ,  GUO-HUA GAO

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03472 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05011 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05562 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： Semiconductor devices and methods are provided. The semiconductor device can include a semiconductor substrate, a plurality of solder pads disposed on the semiconductor substrate, a first insulating layer disposed over the semiconductor substrate, a columnar electrode disposed over the solder pad, and a solder ball disposed on the columnar electrode. The first insulating layer can include a first opening to expose a solder pad of the plurality of solder pads. The columnar electrode can include a bulk material and a through hole in the bulk material. The through hole can expose at least a surface portion of the solder pad. The solder ball can include a convex metal head on a top surface of the bulk material of the columnar electrode, and a filling part filled in the through hole.

摘要翻译： 提供了半导体器件和方法。 半导体器件可以包括半导体衬底，设置在半导体衬底上的多个焊盘，设置在半导体衬底上的第一绝缘层，设置在焊盘上的柱状电极和设置在柱状电极上的焊球。 第一绝缘层可以包括第一开口以暴露多个焊盘的焊盘。 柱状电极可以包括散装材料和散装材料中的通孔。 通孔可以暴露至少一个焊盘的表面部分。 焊球可以包括在柱状电极的本体材料的顶表面上的凸金属头和填充在通孔中的填充部分。