公开(公告)号：US10793686B2

公开(公告)日：2020-10-06

申请号：US16212693

申请日：2018-12-07

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Yi-Kang Lan ,  Shyh-Jang Sun ,  Cheng-Huan Wang ,  Jr-Jeng Ruan ,  Yung-Chin Chien ,  Kai-Chia Yeh

IPC: C08L33/04 ,  C08L57/00 ,  C08F22/10 ,  C08K5/01 ,  C08K5/03 ,  C08K5/053 ,  C08K5/08 ,  C08K5/09 ,  C08K5/11 ,  C08K5/20 ,  C08J3/21 ,  C08J5/04 ,  C08L33/06 ,  C08K5/14 ,  C08J3/09 ,  C08F20/32 ,  C08F18/04 ,  C08F20/26 ,  C08F18/10 ,  C08F6/10 ,  C08F22/20

Abstract: A preparation method of vinyl ester resin for optimizing heat-release during curing includes: (A) providing a vinyl ester, a solvent and a phase change material to perform mixture; (B) performing a heating process to remove the solvent, so as to obtain a vinyl ester resin containing the phase change material. Thereby, the organic PCM material with high heat absorption and good resin affinity can be used as the temperature control agent of the vinyl ester resin during the curing process for avoiding the defects such as bubbles and cracks being generated in the vinyl ester resin.

公开(公告)号：US10913553B2

公开(公告)日：2021-02-09

申请号：US15813343

申请日：2017-11-15

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Mau-Yi Huang ,  Ren-So Deng ,  Geng-Wen Chang ,  Dar-Ping Juang ,  Cheng-Huan Wang

IPC: B64G1/58 ,  B64C1/38 ,  B29C70/08 ,  B29C65/00 ,  B29C65/02 ,  B64C30/00

Abstract: An integrated heat shield which encloses a frame structure comprises a leading edge component, a left side component, a right side component, an optionally top component, an optional bottom component and an optional trailing edge subassembly, wherein the leading edge component and the left and right side components are directly, integrally co-cured on the frame structure while in a B-stage. The leading edge component and the left and right side components are shingle laminated to form ply angles to air flow. The leading edge component and the side components are scarf-jointed or step-jointed. The side components and trailing edge subassembly are also scarf jointed or step-jointed. The co-curing as well as the scarf or step joints makes the heat shield an integrated assembly. A method of manufacturing the integrated heat shield is further introduced.

公开(公告)号：US20200181337A1

公开(公告)日：2020-06-11

申请号：US16212693

申请日：2018-12-07

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Yi-Kang Lan ,  Shyh-Jang Sun ,  Cheng-Huan Wang ,  Jr-Jeng Ruan ,  Yung-Chin Chien ,  Kai-Chia Yeh

IPC: C08J3/21 ,  C08J5/04 ,  C08L33/06 ,  C08K5/14 ,  C08K5/09 ,  C08K5/08 ,  C08K5/03

Abstract: A preparation method of vinyl ester resin for optimizing heat-release during curing includes: (A) providing a vinyl ester, a solvent and a phase change material to perform mixture; (B) performing a heating process to remove the solvent, so as to obtain a vinyl ester resin containing the phase change material. Thereby, the organic PCM material with high heat absorption and good resin affinity can be used as the temperature control agent of the vinyl ester resin during the curing process for avoiding the defects such as bubbles and cracks being generated in the vinyl ester resin.