WET PROCESSING APPARATUS
    1.
    发明申请
    WET PROCESSING APPARATUS 审中-公开
    湿处理设备

    公开(公告)号:US20160293401A1

    公开(公告)日:2016-10-06

    申请号:US15037886

    申请日:2014-12-01

    Abstract: A wafer cleaner and a method therefor that efficiently cleans a wafer with a little amount of a cleaning liquid and efficiently performs a heating wet cleaning processing. The present invention includes a stage where a wafer is placed, a rotary driving unit that rotates the stage in a circumferential direction, a liquid discharge nozzle disposed facing the wafer placed on the stage and supplies a cleaning liquid on the wafer placed on the stage, and a control unit that causes the liquid discharge nozzle to supply a space between the wafer placed on the stage and the liquid discharge nozzle with a predetermined amount of the cleaning liquid to fill the space. The present invention also includes a lamp disposed on a position facing the wafer placed on the stage to heat at least an interface portion of the wafer and a cleaning liquid.

    Abstract translation: 一种晶片清洁器及其方法,其用少量清洗液有效地清洗晶片,并有效地执行加湿湿式清洗处理。 本发明包括一个放置晶片的台阶,一个沿圆周方向转动台面的旋转驱动单元,一个面对设置在台架上的晶圆设置的液体排出喷嘴,并将清洗液体提供在放在平台上的晶片上, 以及控制单元,其使得所述液体排出喷嘴在预定量的所述清洁液体之间提供放置在所述台架上的所述晶片与所述液体排出喷嘴之间的空间以填充所述空间。 本发明还包括一个灯,其设置在面向设置在台架上的晶片的位置上,以加热至少晶片的接口部分和清洁液体。

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