公开(公告)号：US11225436B2

公开(公告)日：2022-01-18

申请号：US16301582

申请日：2017-05-16

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Jun Akedo ,  Hiroaki Noda ,  Hiroki Tsuda ,  Nobuo Sakamoto

IPC: C03C17/42 ,  B05D1/12 ,  B32B9/00 ,  B32B27/18

Abstract: A layered structure having high adhesive properties, and high hardness or excellent transparency, is prepared on a base material such as a resin. A layered structure including: an organic-inorganic hybrid member containing a primary inorganic particle and an organic polymer covalently bound to each other, wherein the primary inorganic particle forms a network containing the polymer; and a particle aggregate layer containing a secondary particle which is deposited on the organic-inorganic hybrid member and is composed of an inorganic material or a metallic material; wherein in the organic-inorganic hybrid member, the primary inorganic particle and the secondary particle have different crystal particle sizes.

公开(公告)号：US11145567B2

公开(公告)日：2021-10-12

申请号：US16058573

申请日：2018-08-08

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Jun Akedo ,  Hiroki Tsuda

IPC: F28F7/00 ,  H01L23/373 ,  H01L23/36 ,  H01L23/12 ,  F28F3/00 ,  F28F21/04 ,  F28F21/08 ,  H01L23/14 ,  H01L23/15

Abstract: A heat-radiating substrate with a high insulation-withstand voltage and an excellent heat-radiating property is provided. The heat-radiating substrate includes: a metal base material; a metal thin layer formed over the metal base material and having a hardness higher than a hardness of the metal base material; and a ceramic layer over the metal thin layer. Alternatively, the heat-radiating substrate includes, instead of the metal thin layer, a hardened layer serving as a surface layer of the metal base material and having a hardness higher than the hardness of the metal base material. The metal thin layer and the hardened layer are able to enhance compressive stress or prevent release of the compressive stress generated in the ceramic layer by a mechanical impact applied to the ceramic layer.

公开(公告)号：US20230234084A1

公开(公告)日：2023-07-27

申请号：US17916077

申请日：2021-03-31

Applicant: Osaka Gas Co., Ltd. ,  National institute of advanced industrial science and technology

Inventor： Kyohei Manabe ,  Katsuki Higaki ,  Hisao Ohnishi ,  Mitsuaki Echigo ,  Tadayuki Sogi ,  Jun Akedo ,  Rintaro Aoyagi ,  Hiroaki Matsui ,  Kentaro Shinoda ,  Hiroki Tsuda

IPC: B05B7/00 ,  B05B16/60 ,  B05B7/14 ,  C23C24/04

CPC classification number: B05B7/0012 ,  B05B16/60 ,  B05B7/1404 ,  B05B7/1486 ,  C23C24/04

Abstract: Provided is a film forming apparatus capable of stably supplying a large amount of ceramic raw material powder for a long time and forming a homogeneous and dense film. A film forming apparatus 1 for forming a film on a base material K includes an aerosol transport path 10 for ejecting an aerosol obtained by dispersing a ceramic raw material powder in a gas, from an ejection end 10a toward the base material K, in which a flow path cross-section at an ejection end 10a of the aerosol transport path 10 has a substantially circular shape with an area of 10 mm2 or more.