Abstract:
The present invention relates to a processing apparatus for growing and annealing a silicon dioxide insulator layer to obtain a mobile positive ion free silicon dioxide insulator layer. A mobile positive ion free silicon dioxide insulator layer is required in order to make a stable insulated gate field effect transistor. The processing apparatus comprises a nonoxidizing high-melting-point platinum metal film coated quartz furnace tube, potential means for placing a positive potential upon the platinum metal film coating of the platinum metal film coated quartz furnace tube to repel mobile ions therefrom, heater means for heating the interior of the quartz furnace tube, and gas means for passing oxygen gas through the platinum metal film coated quartz furnace tube. A silicon wafer may be oxidized in said processing apparatus to form a relatively mobile positive ion free silicon dioxide insulator layer of an insulated gate field effect transistor upon the silicon wafer. The silicon dioxide insulator layer is relatively uncontaminated by mobile positive ions which exist to the outside of the platinum metal film coated quartz furnace tube. A silicon wafer which previously has been coated by a silicon dioxide insulator layer may be processed to remove mobile ions within the silicon dioxide insulator layer. Mobile positive ions are repelled by the positive potential applied to the platinum metal film away from the outside of the quartz furnace tube, and mobile positive ions of the silicon dioxide insulator layer within the platinum metal film coated quartz tube are removed by the flowing oxygen gas due to the low-vapor pressure of the mobile positive ions.
Abstract:
A protection circuit is disclosed for protecting a P-channel enhancement-type metal oxide semiconductor transistor from rupturing due to static voltage building up between its gate and source electrodes. The protection circuit includes at least one N-channel depletion-type transistor having its drain and source electrodes connected between the gate and source electrodes of the enhancement-type transistor and its gate electrode coupled to a negative power supply terminal. A resistor is also included between the gate of the enhancement-type transistor and the terminal to which an input signal is applied. There is also included a diode, in shunt with the resistor and the depletiontype transistor, which is poled to be reverse biased by the input signal.
Abstract:
The present invention relates to a method of forming a thin stratified pinhole-free silicon dioxide insulator layer between multilevel conductors. Silicon dioxide films within the stratified pinhole-free silicon dioxide insulator layer are made from single drops of colloidal silicon dioxide liquid dispersion. These silicon dioxide films are stacked to form a stratified pinhole-free highly insulative silicon dioxide layer between the upper and lower conductors. The thinness of the stratified pinhole-free silicon dioxide insulator layer allows shallow contact windows to be formed therein. A shallow contact window allows reliable electrical contact therethrough between an upper conductor and a lower conductor.