公开(公告)号：US20230313721A1

公开(公告)日：2023-10-05

申请号：US18162748

申请日：2023-02-01

Applicant: NGK Insulators, Ltd.

Inventor： Mako HATTORI

IPC: F01N3/20 ,  F01N3/28 ,  B01J35/04 ,  B01D53/32 ,  B01D53/94 ,  B01J27/224

CPC classification number: F01N3/2026 ,  F01N3/2828 ,  B01J35/04 ,  B01D53/32 ,  B01D53/945 ,  B01J27/224

Abstract: A honeycomb structure including an electrically conductive honeycomb structure portion, comprising an outer peripheral wall, and partition walls disposed inside the outer peripheral wall and partitioning a plurality of cells forming flow paths from one end surface to the other end surface; and a pair of electrode layers provided on an outer surface of the outer peripheral wall so as to face each other across a central axis of the honeycomb structure portion; wherein a coefficient of linear expansion of the honeycomb structure portion measured according to JIS R1618:2002 when temperature is changed from 40° C. to 300 ° C. is 4.1×10−6/° C. or more, and the coefficient of linear expansion of the honeycomb structure portion measured according to JIS R1618:2002 when the temperature is changed from 300 ° C. to 800 ° C. is 4.2×10−6/° C. or more and 4.8×10−6/° C. or less.