公开(公告)号：US20150313015A1

公开(公告)日：2015-10-29

申请号：US14647212

申请日：2013-05-27

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Hidetoshi WADA ,  Tatsuya ITO ,  Makoto NAGAI

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2203/0594 ,  H05K2203/0597 ,  H01L2924/00

Abstract: Provided is a wiring substrate which allows connection terminals to be disposed at high density, can increase the degree of freedom of wiring layout, and can enhance the reliability of connection of the connection terminals. A wiring substrate of the present invention includes a laminate which includes one or more insulating layers and one or more conductor layers laminated together; a wiring formed on the laminate; a columnar connection terminal which is formed directly on the wiring and is in contact with at least one of opposite side surfaces of the wiring; and a solder resist layer which covers the wiring and which exposes at least a portion of the connection terminal. The width of the wiring at a position at which the connection terminal is formed is smaller than the length of the connection terminal in the width direction.

Abstract translation: 提供了一种允许以高密度设置连接端子的布线基板，可以增加布线布局的自由度，并且可以提高连接端子的连接的可靠性。 本发明的布线基板包括一层叠体，其包括一层或多层绝缘层和层压在一起的一层或多层导体层; 形成在层压板上的布线; 一个柱形连接端子，其直接形成在布线上并且与布线的相对侧表面中的至少一个相接触; 以及覆盖所述布线并且暴露所述连接端子的至少一部分的阻焊层。 形成连接端子的位置处的配线的宽度小于连接端子在宽度方向上的长度。