公开(公告)号：US11824325B2

公开(公告)日：2023-11-21

申请号：US17463714

申请日：2021-09-01

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shingo Totani

IPC: H01S5/06 ,  H01S5/0225 ,  H01S5/00

CPC classification number: H01S5/0611 ,  H01S5/0087 ,  H01S5/0225

Abstract: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermo setting resin and having a wiring layer formed between each adjacent layer of the layers in a state in contact with the adjacent layers, a second wiring substrate made of a ceramic, and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other, wherein at least a surface of the joining layer adjacent to the second wiring substrate is made of a thermo plastic resin.