LIGHT EMITTING DEVICE
    1.
    发明公开

    公开(公告)号:US20240250497A1

    公开(公告)日:2024-07-25

    申请号:US18417032

    申请日:2024-01-19

    发明人: Tadayuki KITAJIMA

    摘要: A light emitting device includes: a base having a recess and a flat upper surface; a light emitting element disposed on the upper surface of the base and configured to emit light laterally from an emission end surface; and a reflective member disposed on the upper surface of the base to face the light emitting element with the recess located between part of the reflective member and the light emitting element in a top view, the reflective member having a reflective surface configured to reflect the light upward. At least a portion of the reflective surface overlaps with the recess in the top view. A lower end of the reflective surface is located lower than the upper surface of the base and higher than a bottom surface of the recess in a direction normal to the upper surface of the base.

    MULTIPLE OPTOELECTRONIC DEVICES WITH THERMAL COMPENSATION

    公开(公告)号:US20230387654A1

    公开(公告)日:2023-11-30

    申请号:US18361421

    申请日:2023-07-28

    摘要: An optical apparatus comprising at least two optoelectronic devices fabricated on the same substrate and in thermal communication with each other. A first optoelectronic device is configured to generate optical signals and provide them to an optical system via an optical output port. A second optoelectronic device is configured to provide heat compensation for the first optoelectronic device. An electrical circuitry provides first electrical signals to the first optoelectronic device and second electrical signals to the second optoelectronic device. The electrical circuitry is configured to adjust at least the second electrical signals to controllably adjust a temperature of the first optoelectronic device.

    Light-emitting apparatus and light-emitting element housing

    公开(公告)号:US11824325B2

    公开(公告)日:2023-11-21

    申请号:US17463714

    申请日:2021-09-01

    发明人: Shingo Totani

    IPC分类号: H01S5/06 H01S5/0225 H01S5/00

    摘要: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermo setting resin and having a wiring layer formed between each adjacent layer of the layers in a state in contact with the adjacent layers, a second wiring substrate made of a ceramic, and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other, wherein at least a surface of the joining layer adjacent to the second wiring substrate is made of a thermo plastic resin.

    Electric Pumping Vertical External Cavity Surface Emitting Laser (EP-VECSEL) array

    公开(公告)号:US12057675B1

    公开(公告)日:2024-08-06

    申请号:US18501534

    申请日:2023-11-03

    摘要: An electrical pumping vertical external-cavity surface-emitting laser (EP-VECSEL) device. The device may comprise a bottom contact, a first distributed Bragg reflector (DBR) disposed on the bottom contact, and an active region comprising a plurality of emitters, disposed on the first DBR configured to accept an electrical current at multiple emitters on the active region such that the multiple emitters produce a plurality of lasers. The multiple emitters may be configured to form a desired Hermite Gaussian (HG) mode shape. The device may further comprise a second DBR disposed on the active region and a top contact disposed on the second DBR. The top contact may be shaped such that the plurality of lasers are directed through the top contact. The device may further comprise an array output coupler disposed optically in line with the top contact such that the plurality of lasers are directed into the array output coupler.