公开(公告)号：US20240234366A9

公开(公告)日：2024-07-11

申请号：US18546088

申请日：2022-01-27

Applicant: NHK SPRING CO., LTD.

Inventor： Ryo TANAKA ,  Yuichiro YAMAUCHI ,  Kohei SUZUKI

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/83 ,  H01L23/498 ,  H01L24/32 ,  H01L24/75 ,  H05K1/183 ,  H05K1/186 ,  H05K3/3463 ,  H01L2224/05014 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/75353 ,  H01L2224/83205 ,  H01L2224/83385 ,  H01L2924/3511

Abstract: A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.

公开(公告)号：US20240136325A1

公开(公告)日：2024-04-25

申请号：US18546088

申请日：2022-01-27

Applicant: NHK SPRING CO., LTD.

Inventor： Ryo TANAKA ,  Yuichiro YAMAUCHI ,  Kohei SUZUKI

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/83 ,  H01L23/498 ,  H01L24/32 ,  H01L24/75 ,  H05K1/183 ,  H05K1/186 ,  H05K3/3463 ,  H01L2224/05014 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/75353 ,  H01L2224/83205 ,  H01L2224/83385 ,  H01L2924/3511

Abstract: A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.

公开(公告)号：US20240133440A1

公开(公告)日：2024-04-25

申请号：US18399940

申请日：2023-12-29

Applicant: NHK SPRING CO., LTD.

Inventor： Hideki OKADA ,  Yuichiro YAMAUCHI ,  Ryo TANAKA ,  Takeshi SUZUKI ,  Kosuke SHIBAIRI

IPC: F16F1/04 ,  B60G11/14

CPC classification number: F16F1/042 ,  B60G11/14 ,  B60G2204/1244 ,  F16F2226/023

Abstract: According to an embodiment, a coil spring is formed of a wire which is helically wound, and includes an end turn portion and an effective portion, and a surface of the wire in the end turn portion includes an area which is softer than a surface of the wire in the effective portion.

公开(公告)号：US20240229884A9

公开(公告)日：2024-07-11

申请号：US18399940

申请日：2023-12-29

Applicant: NHK SPRING CO., LTD.

Inventor： Hideki OKADA ,  Yuichiro YAMAUCHI ,  Ryo TANAKA ,  Takeshi SUZUKI ,  Kosuke SHIBAIRI

IPC: F16F1/04 ,  B60G11/14

CPC classification number: F16F1/042 ,  B60G11/14 ,  B60G2204/1244 ,  F16F2226/023

Abstract: According to an embodiment, a coil spring is formed of a wire which is helically wound, and includes an end turn portion and an effective portion, and a surface of the wire in the end turn portion includes an area which is softer than a surface of the wire in the effective portion.

公开(公告)号：US20210362274A1

公开(公告)日：2021-11-25

申请号：US17395684

申请日：2021-08-06

Applicant: NHK SPRING CO., LTD.

Inventor： Takuya SATO ,  Yuichiro YAMAUCHI ,  Takeshi FURUSE ,  Ryo TANAKA

IPC: B23K26/354 ,  B21F3/04 ,  B21F11/00 ,  B23K26/08 ,  B23K26/00

Abstract: A coiling machine includes a laser heating machine configured to irradiate a wire formed into a helical shape with laser light to thereby heat a part of the wire, and cutting components configured to cut a portion of the wire after the irradiation of the laser light is stopped, a temperature of the portion being higher than before irradiated with the laser light.