公开(公告)号：US09761761B2

公开(公告)日：2017-09-12

申请号：US15041921

申请日：2016-02-11

Applicant: NICHIA CORPORATION

Inventor： Shinichi Daikoku ,  Shun Kitahama ,  Keiji Emura ,  Akihiro Nakamura

IPC: H01L33/38 ,  H01L33/42 ,  H01L33/14

CPC classification number: H01L33/38 ,  H01L33/145 ,  H01L33/42

Abstract: A light-emitting element includes a semiconductor stacked body, a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes, insulation films disposed in the plurality of through holes, the plurality of through holes being disposed on the semiconductor stacked body; and a pad electrode disposed on the light transmissive conductive film and the insulation films.

公开(公告)号：US10923632B2

公开(公告)日：2021-02-16

申请号：US16835725

申请日：2020-03-31

Applicant: NICHIA CORPORATION

Inventor： Akihiro Nakamura ,  Keiji Emura

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/32 ,  H01L33/50 ,  H01L33/58

Abstract: A light emitting element includes a semiconductor structure including a first layer including a first and a second regions, and a second layer above the second region, the first region including extending portions each extending into the second region from an outer peripheral region; a first insulating layer including first through-holes respectively located on the extending portions, and a second through-hole located above the second region; a second insulating layer including a third and a fourth through-holes; a first external electrode connected with the first layer via the first through-holes; and a second external electrode connected with the second layer via the second through-hole. The extending portions are each located in an area, on a top surface of the first layer, other than an area overlapping any of corner portions of the first external electrode and other than an area overlapping any of corner portions of the second external electrode.