公开(公告)号：US10825949B2

公开(公告)日：2020-11-03

申请号：US16550908

申请日：2019-08-26

Applicant: NICHIA CORPORATION

Inventor： Makoto Nakano ,  Kenji Nakata

IPC: H01L33/00 ,  H01L33/56

Abstract: Provided is a method of manufacturing a light emitting device, comprising: preparing a base body having a concave portion; disposing a light emitting element at the bottom of the concave portion; disposing a first resin containing first phosphor particles having an average particle size of 10 μm or more and 30 μm or less and a first filler having an average particle size of 5 μm or more and 20 μm or less to cover the light emitting element; centrifugally precipitating the first phosphor particles and the first filler toward the base body; temporarily curing the first resin; disposing a second resin containing second phosphor particles and a second filler having an average particle size of 5 nm or more and 100 nm or less on the first resin temporarily cured; centrifugally precipitating the second phosphor particles and the second filler toward the first resin; and curing the first and second resins.

公开(公告)号：US09831396B2

公开(公告)日：2017-11-28

申请号：US14853311

申请日：2015-09-14

Applicant: NICHIA CORPORATION

Inventor： Shoji Hosokawa ,  Daiki Kuramoto ,  Kenji Nakata ,  Atsushi Bando

IPC: H01L33/00 ,  H01L23/29 ,  H01L33/50 ,  H01L31/0203 ,  H01L21/56 ,  H01L33/52 ,  H01L33/56

CPC classification number: H01L33/502 ,  H01L21/56 ,  H01L23/29 ,  H01L23/295 ,  H01L31/0203 ,  H01L33/501 ,  H01L33/508 ,  H01L33/52 ,  H01L33/56 ,  H01L2924/01015 ,  H01L2924/0106 ,  H01L2924/181 ,  H01L2924/186

Abstract: A light emitting device includes a light emitting element, a molded member, and a sealing member. The light emitting element is arranged on or above the molded member. The sealing member covers the light emitting element. The sealing member contains a phosphor, and a filler material. The phosphor can be excited by light of the light emitting element, and emit luminescent radiation. The filler material contains neodymium hydroxide, neodymium aluminate or neodymium silicate. The filler material absorbs a part of the spectrum of the mixed light of the light emitting element and the phosphor so that the other parts of the spectrum of this mixed light are extracted from the light emitting device.

公开(公告)号：US20200066933A1

公开(公告)日：2020-02-27

申请号：US16550908

申请日：2019-08-26

Applicant: NICHIA CORPORATION

Inventor： Makoto NAKANO ,  Kenji Nakata

IPC: H01L33/00 ,  H01L33/56

Abstract: Provided is a method of manufacturing a light emitting device, comprising: preparing a base body having a concave portion; disposing a light emitting element at the bottom of the concave portion; disposing a first resin containing first phosphor particles having an average particle size of 10 μm or more and 30 μm or less and a first filler having an average particle size of 5 μm or more and 20 μm or less to cover the light emitting element; centrifugally precipitating the first phosphor particles and the first filler toward the base body; temporarily curing the first resin; disposing a second resin containing second phosphor particles and a second filler having an average particle size of 5 nm or more and 100 nm or less on the first resin temporarily cured; centrifugally precipitating the second phosphor particles and the second filler toward the first resin; and curing the first and second resins.