公开(公告)号：US20150171282A1

公开(公告)日：2015-06-18

申请号：US14572779

申请日：2014-12-17

Applicant: NICHIA CORPORATION

Inventor： Ryosuke WAKAKI ,  Morito KANADA

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.

Abstract translation: 树脂封装包括模制树脂外壳，第一引线和第二引线。 模制树脂壳体包括向上敞开的空腔。 空腔包括内表面。 内表面包括弯曲部分和设置在弯曲部分的下侧上的阶梯部分。 第一引线和第二引线设置在空腔的底部，使得第一引线和第二引线的至少一部分从模制树脂外壳露出。 第一引线包括安装有发光元件的升高部分。 提升部的上表面比台阶部的上端部高。

公开(公告)号：US20130193460A1

公开(公告)日：2013-08-01

申请号：US13751790

申请日：2013-01-28

Applicant: NICHIA CORPORATION

Inventor： Morito KANADA ,  Kensaku HAMADA

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a plurality of light emitting elements, a plurality of lead frames, and a package. The light emitting elements are mounted on the lead frames. The package is made of resin. The package has an opening. A part of the lead frames is embedded in an inner portion of the package and another part of the lead frames is exposed on a bottom surface of the opening. A resin bottom surface on which the resin is exposed is provided on the bottom surface of the opening of the package. The package includes a wall portion projecting from the bottom surface of the opening between the light emitting elements in the opening. The light emitting elements are connected by wire that straddles the wall portion.

Abstract translation: 发光器件包括多个发光元件，多个引线框架和封装。 发光元件安装在引线框架上。 包装由树脂制成。 包装有一个开口。 引线框架的一部分嵌入在封装的内部，并且引线框架的另一部分暴露在开口的底表面上。 在封装的开口的底面上设置有露出树脂的树脂底面。 该包装包括从开口中的发光元件之间的开口的底表面突出的壁部分。 发光元件通过跨越壁部的导线连接。