公开(公告)号：US11929294B2

公开(公告)日：2024-03-12

申请号：US17489595

申请日：2021-09-29

申请人： NICHIA CORPORATION

发明人： Masatsugu Ichikawa ,  Shoichi Yamada ,  Takeshi Kihara ,  Yutaka Matsusaka

IPC分类号： H01L23/14 ,  H01L21/48 ,  H01L23/373

CPC分类号： H01L23/142 ,  H01L21/4882 ,  H01L23/3732 ,  H01L23/3733 ,  H01L21/4871 ,  H01L23/3736

摘要： A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.

公开(公告)号：US11799065B2

公开(公告)日：2023-10-24

申请号：US17161305

申请日：2021-01-28

申请人： NICHIA CORPORATION

发明人： Shoichi Yamada ,  Takeshi Kihara ,  Masatsugu Ichikawa

IPC分类号： H01L33/64 ,  B22F3/12 ,  H01L23/373 ,  B22F3/105 ,  B22F7/06 ,  H01L21/48

CPC分类号： H01L33/641 ,  B22F3/105 ,  B22F3/12 ,  B22F7/06 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/3736 ,  B22F2202/06 ,  B22F2301/10 ,  B22F2302/406 ,  B22F2304/10

摘要： A method of producing a heat dissipation substrate, the method including: providing a composite material containing diamond and a metal; performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material; and subsequently, performing pulsed electric current sintering with a pressure of less than 50 MPa applied to the composite material, to heat the composite material.