公开(公告)号：US20190248083A1

公开(公告)日：2019-08-15

申请号：US16393926

申请日：2019-04-24

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Masakazu KOTANI ,  Tetsuji SEINO ,  Shinsaku IKUTA

IPC: B29D11/00 ,  H01L33/00 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.

公开(公告)号：US20180215113A1

公开(公告)日：2018-08-02

申请号：US15925848

申请日：2018-03-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Masakazu KOTANI ,  Tetsuji SEINO ,  Shinsaku IKUTA

IPC: B29D11/00 ,  H01L33/00 ,  B29K83/00 ,  B29L31/34 ,  B29K105/04

CPC classification number: B29D11/00865 ,  B29D11/0074 ,  B29D11/00807 ,  B29K2083/00 ,  B29K2105/04 ,  B29K2995/0018 ,  B29L2031/3481 ,  H01L33/00 ,  H01L33/505 ,  H01L33/54 ,  H01L2933/005

Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.

公开(公告)号：US20200147908A1

公开(公告)日：2020-05-14

申请号：US16737904

申请日：2020-01-09

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Masakazu KOTANI ,  Tetsuji SEINO ,  Shinsaku IKUTA

IPC: B29D11/00 ,  H01L33/00 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.

公开(公告)号：US20160265741A1

公开(公告)日：2016-09-15

申请号：US15067239

申请日：2016-03-11

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Masakazu KOTANI ,  Tetsuji SEINO ,  Shinsaku IKUTA

IPC: F21V5/04 ,  B29D11/00

CPC classification number: B29D11/00865 ,  B29D11/0074 ,  B29D11/00807 ,  B29K2083/00 ,  B29K2105/04 ,  B29K2995/0018 ,  B29L2031/3481 ,  H01L33/00 ,  H01L33/505 ,  H01L33/54 ,  H01L2933/005

Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis. The covering member tapers toward the bottom surface.

Abstract translation: 发光装置包括基板，光源和覆盖部件。 光源具有光轴，光源底部以及与光源底部在光轴上相反的光源上部。 光源设置在光源底部的基板上。 覆盖构件具有底面和与光轴的底面相对的顶部，并且设置在底面的基板上以覆盖光源。 覆盖部件在光源上方的顶部部分和光轴周围具有凹部。 覆盖件朝向底面逐渐变细。