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    LIGHT EMITTING DEVICE
    2.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20160343918A1

    公开(公告)日：2016-11-24

    申请号：US15160444

    申请日：2016-05-20

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Tomonori OZAKI ,  Shinsaku IKUTA ,  Yuichi YAMADA

    IPC: H01L33/54 ,  H01L33/56 ,  H01L33/50 ,  H01L33/58

    Abstract: A light emitting device includes a light emitting element; a sealing resin covering the light emitting element; and a light diffusing material contained in the sealing resin. When a difference in refractive index at 10° C. between the sealing resin and the light diffusing material is Δn1 and a difference in refractive index at 50° C. between the sealing resin and the light diffusing material is Δn2, a ratio of Δn2 to Δn1 is in a range of 95% to 105%.

    Abstract translation: 发光器件包括发光元件; 覆盖发光元件的密封树脂; 以及包含在密封树脂中的光漫射材料。 当密封树脂和光扩散材料之间在10℃的折射率差为Δn1时，密封树脂和光漫射材料之间的折射率差在50℃是Δn2，Δn2与 Δn1在95％至105％的范围内。

    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE
    3.
    发明申请
    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20250056942A1

    公开(公告)日：2025-02-13

    申请号：US18932321

    申请日：2024-10-30

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

    IPC: H01L33/60 ,  F21V3/06 ,  F21Y105/16 ,  F21Y115/10 ,  H01L33/54

    Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号：US20160265741A1

    公开(公告)日：2016-09-15

    申请号：US15067239

    申请日：2016-03-11

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Masakazu KOTANI ,  Tetsuji SEINO ,  Shinsaku IKUTA

    IPC: F21V5/04 ,  B29D11/00

    CPC classification number: B29D11/00865 ,  B29D11/0074 ,  B29D11/00807 ,  B29K2083/00 ,  B29K2105/04 ,  B29K2995/0018 ,  B29L2031/3481 ,  H01L33/00 ,  H01L33/505 ,  H01L33/54 ,  H01L2933/005

    Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis. The covering member tapers toward the bottom surface.

    Abstract translation: 发光装置包括基板，光源和覆盖部件。 光源具有光轴，光源底部以及与光源底部在光轴上相反的光源上部。 光源设置在光源底部的基板上。 覆盖构件具有底面和与光轴的底面相对的顶部，并且设置在底面的基板上以覆盖光源。 覆盖部件在光源上方的顶部部分和光轴周围具有凹部。 覆盖件朝向底面逐渐变细。

    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE
    6.
    发明申请
    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20230096212A1

    公开(公告)日：2023-03-30

    申请号：US18050896

    申请日：2022-10-28

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

    IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54 ,  F21Y115/10 ,  F21Y105/16

    Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

    LIGHT EMITTING DEVICE AND LED PACKAGE
    7.
    发明申请
    LIGHT EMITTING DEVICE AND LED PACKAGE 有权

    公开(公告)号：US20210167263A1

    公开(公告)日：2021-06-03

    申请号：US17103719

    申请日：2020-11-24

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

    IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54

    Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

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