公开(公告)号：US12243972B2

公开(公告)日：2025-03-04

申请号：US17724139

申请日：2022-04-19

Applicant: NICHIA CORPORATION

Inventor： Daisuke Kishikawa ,  Takaaki Tada ,  Tomohisa Toda ,  Naoki Ishida ,  Yoshiki Endo

IPC: H01L21/00 ,  H01L33/48 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device includes: a base having an upper face; a light emitting element mounted on the upper face of the base; one or more bonding members disposed on the upper face of the base outward of the light emitting element; a light transmissive member bonded to a portion of the upper face of the base by the one or more bonding members; and a protective film that continuously covers the light emitting element, the upper face of the base, lateral faces of the one or more bonding members, and a lower face of the light transmissive member. A gap is located between the upper face of the base and the lower face of the light transmissive member and configured to allow a space in which the light emitting element is mounted to communicate with an outside of the light emitting device, wherein the gap is defined by the upper face of the base, the lower face of the light transmissive member, and the one or more bonding members.

公开(公告)号：US10411173B2

公开(公告)日：2019-09-10

申请号：US15086873

申请日：2016-03-31

Applicant: NICHIA CORPORATION

Inventor： Takanori Aruga ,  Yoshiki Endo ,  Takuya Yamanoi ,  Daisuke Kishikawa ,  Yoshitaka Tanaka

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/58 ,  H01L25/13 ,  H01L33/62

Abstract: A light emitting device and light emitting module using the same are provided. The light emitting device includes a substrate, a light-emitting element provided on the substrate, and a light transmissive sealing member covering the light-emitting element on the substrate. The light transmissive sealing member includes a body portion and a lens portion that are sequentially disposed from a substrate side.