公开(公告)号：US10293369B2

公开(公告)日：2019-05-21

申请号：US15854763

申请日：2017-12-27

Applicant: NICHIA CORPORATION

Inventor： Toshihiko Aizawa ,  Masato Ono ,  Daisuke Kishikawa

IPC: B05D3/06 ,  H01L25/075 ,  H01L33/62 ,  F21V5/00 ,  F21V5/04 ,  H01L33/58 ,  F21Y115/10 ,  F21Y105/16 ,  H01L33/46 ,  H01L33/54

Abstract: A light emitting device is provided which includes a printed board, light emitting elements, and a light-transmissive member. The light emitting elements are arranged in three or more rows, and mounted on the printed board. The light-transmissive member includes three or more semi-semi-cylindrical lens portions that are arranged side by side transversely to cover the three or more rows. The heights of the tops of the semi-cylindrical lens portions are substantially equal to each other. The semi-cylindrical lens portions include first semi-cylindrical lens portions which are arranged to cover at least the both end rows, and a second semi-cylindrical lens portion which is arranged on the interior sides relative to the first semi-cylindrical lens portions in the transverse direction. The radius of curvature of the second semi-cylindrical lens portion is smaller than the first semi-cylindrical lens portions.

公开(公告)号：US09941451B2

公开(公告)日：2018-04-10

申请号：US15336800

申请日：2016-10-28

Applicant: NICHIA CORPORATION

Inventor： Daisuke Kishikawa

IPC: H01L33/00 ,  H01L21/00 ,  H01L33/56 ,  H01L33/62 ,  H05K1/18 ,  H05K3/30 ,  H05K13/04 ,  H01L33/54 ,  H01L33/64

CPC classification number: H01L33/56 ,  H01L33/54 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2933/0066 ,  H05K1/181 ,  H05K3/303 ,  H05K13/0404 ,  H05K2201/10106

Abstract: A light emitting device includes a wiring board, a light emitting element, and a protection film. The wiring board includes a base member, and positive and negative wiring layer parts. The positive and negative wiring layer parts are arranged on or above the upper surface of the base member. The light emitting element is mounted on the wiring layer parts in a flip-chip manner. The protection film covers the base member, the wiring layer parts and the light emitting element, and is formed of an inorganic material for serving as the exterior surface of the light emitting device. Each of the wiring layer parts has a curved outer-side edge. The curvature of the outer-side edge is substantially constant.

公开(公告)号：US12243972B2

公开(公告)日：2025-03-04

申请号：US17724139

申请日：2022-04-19

Applicant: NICHIA CORPORATION

Inventor： Daisuke Kishikawa ,  Takaaki Tada ,  Tomohisa Toda ,  Naoki Ishida ,  Yoshiki Endo

IPC: H01L21/00 ,  H01L33/48 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device includes: a base having an upper face; a light emitting element mounted on the upper face of the base; one or more bonding members disposed on the upper face of the base outward of the light emitting element; a light transmissive member bonded to a portion of the upper face of the base by the one or more bonding members; and a protective film that continuously covers the light emitting element, the upper face of the base, lateral faces of the one or more bonding members, and a lower face of the light transmissive member. A gap is located between the upper face of the base and the lower face of the light transmissive member and configured to allow a space in which the light emitting element is mounted to communicate with an outside of the light emitting device, wherein the gap is defined by the upper face of the base, the lower face of the light transmissive member, and the one or more bonding members.

公开(公告)号：US10411173B2

公开(公告)日：2019-09-10

申请号：US15086873

申请日：2016-03-31

Applicant: NICHIA CORPORATION

Inventor： Takanori Aruga ,  Yoshiki Endo ,  Takuya Yamanoi ,  Daisuke Kishikawa ,  Yoshitaka Tanaka

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/58 ,  H01L25/13 ,  H01L33/62

Abstract: A light emitting device and light emitting module using the same are provided. The light emitting device includes a substrate, a light-emitting element provided on the substrate, and a light transmissive sealing member covering the light-emitting element on the substrate. The light transmissive sealing member includes a body portion and a lens portion that are sequentially disposed from a substrate side.

公开(公告)号：US10683987B2

公开(公告)日：2020-06-16

申请号：US15499641

申请日：2017-04-27

Applicant: NICHIA CORPORATION

Inventor： Daisuke Kishikawa ,  Toshihiko Aizawa ,  Masato Ono

IPC: H01L21/02 ,  F21V5/04 ,  B41J11/00 ,  F26B3/28 ,  F21V5/00 ,  G02B19/00 ,  B41F23/04 ,  F21Y115/10 ,  F21Y105/10 ,  G02B3/00 ,  F21Y103/10

Abstract: A light emitting device includes a substrate, a plurality of light emitting elements arranged in three or more rows on the substrate, and a light-transmissive member including a cylindrical lens portion having an array of three or more cylindrical lenses arranged parallel to each other along the rows of the light emitting elements so that each of the cylindrical lenses is on one of the three or more rows of light emitting elements. The rows of the light emitting elements are arranged with substantially uniform intervals. The cylindrical lens portion includes first cylindrical lens portions including at least cylindrical lenses at outermost sides of the array, and a second cylindrical lens portion arranged at an inner side of the first cylindrical lens portions and having a height greatest in the cylindrical lens portion.

公开(公告)号：US10014457B2

公开(公告)日：2018-07-03

申请号：US15387675

申请日：2016-12-22

Applicant: NICHIA CORPORATION

Inventor： Masato Ono ,  Daisuke Kishikawa ,  Toshihiko Aizawa

IPC: H01L29/18 ,  H01L33/62 ,  H01L27/15 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48095 ,  H01L2224/49111

Abstract: A light emitting device includes light emitting elements. A substrate includes electrically conductive layers each having a first region in which the light emitting elements are arranged and a second region connected to the first region and provided at a position higher than the first region. An electrically conductive wire electrically connects the light emitting elements arranged on the electrically conductive layer and the second region of the adjacent electrically conductive layer. A resin molded portion is formed of a light-transmissive resin that seals the light emitting elements and the electrically conductive wire. The resin molded portion has a shape in which centrally projected cylindrical lens portions is aligned, and in each of the cylindrical lens portions, the light emitting elements is arranged in a line shape. The second region is arranged between the light emitting elements in the light emitting element array.

公开(公告)号：USD728491S1

公开(公告)日：2015-05-05

申请号：US29457409

申请日：2013-06-10

Applicant: Nichia Corporation

Designer： Takuya Nakabayashi ,  Masaki Hayashi ,  Daisuke Kishikawa