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公开(公告)号：US20220009040A1
公开(公告)日：2022-01-13
申请号：US17294379
申请日：2019-10-31
Applicant: NIHON SUPERIOR CO., LTD. , The University of Queensland
Inventor： Kazuhiro NOGITA , Stuart David MCDONALD , Shiqian LIU , Tetsuro NISHIMURA , Takatoshi NISHIMURA , Tetsuya AKAIWA
Abstract: In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGa2 or (Cu, Ni)Ga2 between the first and second metal base materials, thereby joining the first and second metal material.
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公开(公告)号：US20220297243A1
公开(公告)日：2022-09-22
申请号：US17639544
申请日：2020-09-02
Applicant: NIHON SUPERIOR CO., LTD.
Inventor： Tetsuro NISHIMURA
Abstract: By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed. of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu—Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, and reliability higher than ever can be formed.
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公开(公告)号：US20220274212A1
公开(公告)日：2022-09-01
申请号：US17630061
申请日：2020-07-22
Applicant: NIHON SUPERIOR CO., LTD.
Inventor： Tetsuro NISHIMURA
Abstract: Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu-Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu-Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu-Ni alloy, or contains Ni when the metal particle is formed of the Cu-Co alloy, and (Cu,Ni) 6Sn5 is formed on a surface of the metal particle. With this preformed solder, a bonded portion having heat resistance, thermal conductivity, and reliability higher than ever can be formed.
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公开(公告)号：US20160032424A1
公开(公告)日：2016-02-04
申请号：US14775013
申请日：2014-03-12
Applicant: NIHON SUPERIOR CO., LTD.
Inventor： Tetsuro NISHIMURA , Shoichi SUENAGA , Takashi NOZU , Motonori MIYAOKA , Yasufumi SHIBATA
CPC classification number: C22C13/00 , B23K1/0006 , B23K1/0016 , B23K1/19 , B23K35/007 , B23K35/282 , B23K35/3006 , B23K2101/36 , B23K2103/08 , B23K2103/12 , B23K2103/18
Abstract: A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less.
Abstract translation: 通过在凝固点积极地最小化银 - 锌金属间化合物的粒径而获得具有高接合强度的银电极接头。 使用包含2-9重量％的锌，0.0001-0.1重量％的锰和余量由锡组成的焊料合金将至少与其表面层相连的包含银的接合体连接到被接合物上， 具有接合界面的焊接接头，其中由作为被接合物的表面层的银和焊料合金中的锌形成的银 - 锌金属间化合物的粒径为5μm以下。
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公开(公告)号：US20220281035A1
公开(公告)日：2022-09-08
申请号：US17632777
申请日：2020-08-05
Applicant: NIHON SUPERIOR CO., LTD. , Merck Patent GmbH
Inventor： Tetsuro NISHIMURA , Takatoshi NISHIMURA , Tetsuya AKAIWA , Katsuhiko YASU , Hikaru UNO
Abstract: Provided is a solder-metal mesh composite material in which a lead-free solder layer formed of Sn—Cu—Ni-based lead-free solder contains metal mesh having high thermal conductivity, a void occupancy in a cross-section in a thickness direction is 15% or less, and the Sn—Cu—Ni-based lead-free solder contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, and Sn as a remainder or contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, 0.001 to 1% by weight of Ge, and Sn as a remainder.
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Patent Agency Ranking
公开(公告)号：US20220016733A1
公开(公告)日：2022-01-20
申请号：US17272246
申请日：2020-04-10
Applicant: NIHON SUPERIOR CO., LTD.
Inventor： Tetsuro NISHIMURA
Abstract: A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 parts by mass or more and 0.1 parts by mass or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.
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公开(公告)号：US20240238915A1
公开(公告)日：2024-07-18
申请号：US18289495
申请日：2021-12-28
Applicant: NIHON SUPERIOR CO., LTD.
Inventor： Tetsuro NISHIMURA , Kenji NAKAMURA , Junya MASUDA
CPC classification number: B23K35/264 , B23K35/025 , C22C12/00 , C22C13/02
Abstract: The present invention relates to a solder paste containing solder powder and a flux, wherein the solder powder is a lead-free solder alloy having a solidus temperature of 150° C. or less, the flux contains: a rosin; a solvent; a thixotropic agent; and an organic acid and an imidazole as an activator, the organic acid includes one or more kinds of dicarboxylic acids having 4 to 6 carbon atoms, and the imidazole includes one or more kinds among imidazole compounds having 3 to 6 carbon atoms and derivatives thereof.
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公开(公告)号：US20220105593A1
公开(公告)日：2022-04-07
申请号：US17297966
申请日：2019-11-29
Applicant: NIHON SUPERIOR CO., LTD.
Inventor： Takatoshi NISHIMURA , Tetsuro NISHIMURA , Tetsuya AKAIWA
IPC: B23K35/26
Abstract: A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.
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公开(公告)号：US20160375517A1
公开(公告)日：2016-12-29
申请号：US15183895
申请日：2016-06-16
Applicant: NIHON SUPERIOR CO., LTD.
Inventor： Tetsuro NISHIMURA , Yutaka FUKUSHIMA , Hideki YOSHIDA
CPC classification number: B23K3/063 , B23K35/0227
Abstract: A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.
Abstract translation: 焊丝无梭线圈包括通过将焊丝卷绕成中空柱状而形成的焊丝线圈，所述焊丝线圈在所述中空柱的一端具有第一线圈开口，在所述中空柱的另一端具有第二线圈开口 柱状 以及覆盖所述焊丝线圈的外表面的覆盖膜。 覆盖膜具有比覆盖第一线圈开口的部分上的第一线圈开口小的第一膜开口和等于或小于覆盖第二线圈开口的部分上的第二线圈开口的第二膜开口，并且第一膜开口 在其周边区域包括第一突出部，该第一突出部延伸成向第一线圈开口的内侧突出。
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公开(公告)号：US20160368102A1
公开(公告)日：2016-12-22
申请号：US14901638
申请日：2015-04-28
Applicant: NIHON SUPERIOR CO., LTD
Inventor： Tetsuro NISHIMURA , Takatoshi NISHIMURA
CPC classification number: B23K35/262 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/3613 , B23K35/362 , C22C13/00 , C22C13/02 , H01R4/02
Abstract: Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.
Abstract translation: 提供了即使在焊接后的高温状态下也能够保持强接合强度并且具有高可靠性和多功能性的无铅焊料合金和焊接。 本发明的无铅焊料合金组合物具有Sn-Cu-Ni作为碱性组成，其包含0.1〜2.0质量％的Cu，0.01〜0.5质量％的Ni，0.1〜5质量％的Bi，以及 76.0〜99.5质量％的Sn，使得即使在长时间暴露于高温的状态下也可以高度可靠地实施焊接而不降低焊接接头的接合强度，以及此时的接合强度 的粘合。
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