公开(公告)号：US6373000B2

公开(公告)日：2002-04-16

申请号：US73589300

申请日：2000-12-14

申请人： NITTO DENKO CORP

发明人： NAKAMURA KEI ,  SUGIMOTO MASAKAZU ,  INOUE YASUSHI ,  NAGASAWA MEGUMU ,  OKEYUI TAKUJI ,  KANETO MASAYUKI ,  OTA SHINYA

IPC分类号： H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46 ,  H01R23/72

CPC分类号： H05K3/4038 ,  H05K3/3484 ,  H05K3/445 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4641 ,  H05K2201/0215 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2203/0425 ,  H05K2203/1461

摘要： A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

摘要翻译： 在循环试验中防止焊料导体变形以保持高连接可靠性的双面电路板包括由有机高分子量树脂制成的绝缘层2和设置在第二侧的电路3 绝缘层2，两侧的电路3通过填充有分散在其中的金属粉末6的由焊料制成的导体4的通孔而电连接。