公开(公告)号：US11171514B2

公开(公告)日：2021-11-09

申请号：US16492484

申请日：2018-03-28

Applicant: NITTO DENKO CORPORATION

Inventor： Taiki Sueyoshi ,  Masami Inoue ,  Hisashi Tsuda ,  Takashi Oda ,  Kaoru Ito ,  Hideshi Yamakawa ,  Daigo Tsubai ,  Toru Mizutani ,  Yasuyuki Ota

IPC: H02J7/02 ,  H02J50/12 ,  H01F5/06 ,  H01F38/14 ,  H02J5/00

Abstract: A wireless power transmission system includes a power-supplying device including an electronic oscillator that generates electric power having a frequency of 1 MHz or more and 5 MHz or less, and a power-supplying coil member in which the electric power flows; and a power-receiving device including a power-receiving coil member that is capable of generating electric power based on the magnetic field generating from the power-supplying coil member, wherein the power-receiving coil member is a sheet coil including an insulating layer and a first coil pattern disposed at one side of the insulating layer, the first coil pattern is composed of wires, and the wires are disposed in spaced apart relation from each other with a predetermined space provided therebetween in the radial direction of the first coil pattern.

公开(公告)号：US11910526B2

公开(公告)日：2024-02-20

申请号：US17636251

申请日：2020-06-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato Takakura ,  Daigo Tsubai ,  Hiroaki Machitani

IPC: H05K1/05 ,  H05K1/09 ,  H01B1/02

CPC classification number: H05K1/056 ,  H01B1/026 ,  H05K1/09 ,  H05K2201/0154

Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 μm or more.