公开(公告)号：US11272615B2

公开(公告)日：2022-03-08

申请号：US17057906

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Hiroaki Machitani ,  Yasunari Oyabu ,  Masaki Ito ,  Kenya Takimoto

IPC: H05K1/02 ,  H05K1/11

Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.

公开(公告)号：US12284757B2

公开(公告)日：2025-04-22

申请号：US17908470

申请日：2021-02-24

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Hiroaki Machitani ,  Teppei Niino

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/05 ,  H05K3/32 ,  H05K3/46 ,  H05K1/18

Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.

公开(公告)号：US11825598B2

公开(公告)日：2023-11-21

申请号：US17441918

申请日：2020-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Ryosuke Sasaoka ,  Yasunari Oyabu ,  Hiroaki Machitani ,  Hayato Takakura

IPC: H05K3/00 ,  H05K1/02

CPC classification number: H05K1/0266 ,  H05K3/0017

Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.

公开(公告)号：US11910526B2

公开(公告)日：2024-02-20

申请号：US17636251

申请日：2020-06-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato Takakura ,  Daigo Tsubai ,  Hiroaki Machitani

IPC: H05K1/05 ,  H05K1/09 ,  H01B1/02

CPC classification number: H05K1/056 ,  H01B1/026 ,  H05K1/09 ,  H05K2201/0154

Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 μm or more.