公开(公告)号：US11369024B2

公开(公告)日：2022-06-21

申请号：US17090203

申请日：2020-11-05

Applicant: NITTO DENKO CORPORATION

Inventor： Takahiro Takano ,  Kazushi Ichikawa

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/02

Abstract: In a method for producing a wiring circuit board, a conductive pattern is formed using a plating resist formed by photolithography for sequentially moving one photomask in a first direction with respect to a dry film resist to be exposed a plurality of times. The conductive pattern has a conductive intermediate portion which is inclined. The one photomask has a third photo pattern. The third photo pattern includes a first photoline pattern and a second photo line pattern. A first portion of the first photoline pattern coincides with a second portion of the second photoline pattern when projected in the first direction.

公开(公告)号：US20230258893A1

公开(公告)日：2023-08-17

申请号：US18010564

申请日：2021-07-14

Applicant: NITTO DENKO CORPORATION

Inventor： Tadao Okawa ,  Takashi Oda ,  Masataka Yamaji ,  Kazushi Ichikawa

IPC: G02B6/42

CPC classification number: G02B6/428

Abstract: In an opto-electric hybrid board, an electric circuit part E is provided on a first surface side of an insulative layer, and includes pads for mounting an optical element, pads for a driving device for the optical element, and electrical interconnect lines Y including interconnect line portions A connecting the pads. A metal reinforcement layer and an optical waveguide W partially overlapping the metal reinforcement layer are provided on a second surface side of the insulative layer. A portion of the metal reinforcement layer which faces the interconnect line portions A on the opposite side of the insulative layer therefrom is removed to form an opening. This opto-electric hybrid board is capable of transmitting higher-frequency electric signals because the influence of the metal reinforcement layer on electrical properties is suppressed.

公开(公告)号：US20230280554A1

公开(公告)日：2023-09-07

申请号：US18010561

申请日：2021-07-02

Applicant: NITTO DENKO CORPORATION

Inventor： Tadao Okawa ,  Takashi Oda ,  Masataka Yamaji ,  Kazushi Ichikawa

IPC: G02B6/42 ,  H05K1/02

CPC classification number: G02B6/428 ,  H05K1/0274 ,  G02B6/4293

Abstract: An opto-electric hybrid board for an optical communication module in which an electric circuit part E including a pad for mounting an optical element, a pad for an optical element driving device, and an electrical interconnect line Y including an interconnect line portion A connecting the pads is provided on a first surface side of an insulative layer, and in which an optical waveguide W is on a second surface side of the insulative layer. A portion of a coverlay covering the electric circuit part E which overlaps the interconnect line portion A is removed to form an opening. The interconnect line portion A exposed through the opening is used as a terminal for a burn-in test of an optical element.

公开(公告)号：US20230254973A1

公开(公告)日：2023-08-10

申请号：US18009063

申请日：2021-06-21

Applicant: NITTO DENKO CORPORATION

Inventor： Tadao Okawa ,  Takashi Oda ,  Masataka Yamaji ,  Kazushi Ichikawa

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/14 ,  G02B6/12

CPC classification number: H05K1/117 ,  H05K1/0271 ,  H05K1/144 ,  G02B6/12 ,  H05K2201/1034 ,  H05K2201/041 ,  H05K2201/10121

Abstract: An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.