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公开(公告)号：US11387040B2
公开(公告)日：2022-07-12
申请号：US16467175
申请日：2017-11-16
摘要： A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.
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公开(公告)号：US12125621B2
公开(公告)日：2024-10-22
申请号：US17437668
申请日：2020-02-05
CPC分类号： H01F1/24 , H01F17/0006 , H01F17/04 , H01F27/2823 , H01F2017/0066 , H01F2017/048 , Y10T428/32
摘要： An inductor includes a wire including a conducting line, and an insulating film disposed on an entire circumferential surface of the conducting line, and a magnetic layer embedding the wire. The magnetic layer contains a magnetic particle. The magnetic layer includes a first layer in contact with the circumferential surface of the wire, a second layer in contact with the surface of the first layer, . . . and the n-th layer (n is a positive number of 3 or more) in contact with the surface of the (n−1)th layer. In the two layers adjacent to each other in the magnetic layer, the relative magnetic permeability of the layer closer to the wire is lower than the relative magnetic permeability of the layer farther from the wire.
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公开(公告)号：US11948720B2
公开(公告)日：2024-04-02
申请号：US17253793
申请日：2019-06-04
IPC分类号： H01F17/00 , H01F1/12 , H01F17/04 , H01F27/255 , H01F27/28
CPC分类号： H01F27/255 , H01F1/12 , H01F17/04 , H01F27/2823
摘要： An inductor includes a wire having a generally circular shape in cross section, and the magnetic layer covering the wire, wherein the wire includes a conductive wire and an insulating layer covering the conductive wire, the magnetic layer contains anisotropic magnetic particles and a binder, and includes in a surrounding region of the wire within 1.5 times the radius of the wire, a first region in which the anisotropic magnetic particles are oriented along the circumferential direction of the wire, and a second region in which the anisotropic magnetic particles are oriented along the crossing direction that crosses the circumferential direction, or in which the anisotropic magnetic particles are not oriented.
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公开(公告)号：US10194861B2
公开(公告)日：2019-02-05
申请号：US15741942
申请日：2016-06-01
发明人： Keisuke Okumura , Eiji Toyoda , Shotaro Masuda
摘要： A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.
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公开(公告)号：US11783983B2
公开(公告)日：2023-10-10
申请号：US17174988
申请日：2021-02-12
CPC分类号： H01F17/04 , B32B3/30 , B32B7/025 , H01F1/26 , H01F27/255 , B32B5/16 , B32B2264/10 , B32B2264/12 , B32B2307/208 , B32B2457/00 , H01F2017/048 , Y10T428/32
摘要： A laminated sheet includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a processing stability layer disposed on at least one surface 6 in a thickness direction of the inductor. The magnetic layer includes a binder and a magnetic particle having a generally flat shape and whose material is a metal. The processing stability layer includes a cured product of a thermosetting resin composition. The thermosetting resin composition includes a thermosetting resin as an essential component. The thermosetting resin composition includes at least one kind of particle, as an optical component, selected from the group consisting of a first particle having a generally spherical shape and a second particle having a generally flat shape and whose material is an inorganic compound.
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公开(公告)号：US11508507B2
公开(公告)日：2022-11-22
申请号：US16980614
申请日：2018-10-19
摘要： A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.
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公开(公告)号：US11006530B2
公开(公告)日：2021-05-11
申请号：US15741940
申请日：2016-06-01
发明人： Keisuke Okumura , Eiji Toyoda , Shotaro Masuda
摘要： A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.
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公开(公告)号：US11154202B2
公开(公告)日：2021-10-26
申请号：US16087935
申请日：2017-02-03
发明人： Keisuke Okumura , Ryoma Yoshioka
摘要： A management method of a patch for managing a sticking state of a patch with respect to an individual having a body temperature includes a step (1) of sticking the patch to the individual, a step (2) of detecting a temperature change caused by sticking the patch to the individual, and a step (3) of judging whether or not the patch is stuck to the individual based on a presence or absence of the temperature change.
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公开(公告)号：US11073645B2
公开(公告)日：2021-07-27
申请号：US16087942
申请日：2017-02-03
发明人： Keisuke Okumura , Ryoma Yoshioka
IPC分类号： G02B5/28 , G02B26/02 , H01L31/0445 , H01L31/048
摘要： A temperature sensor includes a solar cell, and a thermochromic resin covering the solar cell and having a light transmittance changeable according to a temperature change.
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公开(公告)号：US11006515B2
公开(公告)日：2021-05-11
申请号：US17044448
申请日：2019-04-02
摘要： A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the insulating layer, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.
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