公开(公告)号：US20140004683A1

公开(公告)日：2014-01-02

申请号：US13924420

申请日：2013-06-21

Applicant: NITTO DENKO CORPORATION

Inventor： Shinya Akizuki ,  Toshimasa Sugimura ,  Daisuke Uenda ,  Takeshi Matsumura

IPC: H01L21/58

CPC classification number: H01L21/2007 ,  H01L21/02002 ,  H01L21/0495 ,  H01L21/6835 ,  H01L33/0079 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/0001

Abstract: A method of manufacturing a semiconductor element is provided. The method includes the steps of: bonding a substrate for transferring and a functional layer that is formed on a substrate for forming a functional layer with a temporary fixing layer interposed therebetween; removing the substrate for forming a functional layer to expose the functional layer; bonding a final substrate to the exposed functional layer; and separating the temporary fixing layer and the substrate for transferring from the functional layer, wherein the temporary fixing layer has (A) a specific shear adhering strength or has (B) a specific weight loss rate.

Abstract translation: 提供一种制造半导体元件的方法。 该方法包括以下步骤：将用于转印的基板和形成在用于形成功能层的基板上形成的功能层与其间插入临时固定层的方法相结合; 去除用于形成功能层的基板以暴露功能层; 将最终的基底粘合到暴露的功能层; 并且从功能层分离临时固定层和用于转移的基板，其中临时固定层具有（A）特定的剪切粘合强度或具有（B）比重损失率。

公开(公告)号：US20140004637A1

公开(公告)日：2014-01-02

申请号：US13917330

申请日：2013-06-13

Applicant: NITTO DENKO CORPORATION

Inventor： Tomokazu Takahashi ,  Shinya Akizuki ,  Toshimasa Sugimura ,  Takeshi Matsumura ,  Daisuke Uenda

IPC: H01L33/46

CPC classification number: H01L33/46 ,  H01L21/6836 ,  H01L33/0079 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.

Abstract translation: 根据本发明的实施例的制造LED的方法包括：背面研磨包括所述基板的LED晶片的基板和形成在所述基板的一个表面上的发光元件; 在后研磨之后，在基板的外侧上形成反射层; 并且在所述LED晶片的发光元件的外侧附着耐热粘合片。

公开(公告)号：US20130157419A1

公开(公告)日：2013-06-20

申请号：US13718821

申请日：2012-12-18

Applicant: NITTO DENKO CORPORATION

Inventor： Yusaku Shimizu ,  Shinya Akizuki ,  Takashi Oda ,  Eiji Toyoda ,  Takeshi Matsumura

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/00

Abstract: The objective of the present invention is to provide a method of manufacturing a semiconductor device having less contamination of a semiconductor chip and good productivity. The present invention is a method of manufacturing a semiconductor device having a semiconductor chip, with the steps of preparing a plurality of semiconductor chips, preparing a resin sheet having a thermosetting resin layer, arranging the plurality of semiconductor chips on the thermosetting resin layer, arranging a cover film on the plurality of semiconductor chips, and embedding the plurality of semiconductor chips in the thermosetting resin layer by a pressure applied through the arranged cover film, in which the contact angle of the cover film to water is 90° or less.

Abstract translation: 本发明的目的是提供一种制造半导体芯片污染少且生产率高的半导体器件的方法。 本发明是一种制造具有半导体芯片的半导体器件的方法，其具有制备多个半导体芯片的步骤，制备具有热固性树脂层的树脂片，将多个半导体芯片布置在热固性树脂层上，布置 所述多个半导体芯片上的覆盖膜，并且通过所述布置的覆盖膜施加的压力将所述多个半导体芯片嵌入所述热固性树脂层中，所述覆盖膜与水的接触角为90°以下。