公开(公告)号：US09147625B2

公开(公告)日：2015-09-29

申请号：US13973863

申请日：2013-08-22

Applicant: NITTO DENKO CORPORATION

Inventor： Yusaku Shimizu ,  Takeshi Matsumura ,  Eiji Toyoda ,  Tsuyoshi Torinari ,  Daisuke Uenda

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/293 ,  H01L21/56 ,  H01L2924/0002 ,  Y10T428/31663 ,  Y10T428/31678 ,  H01L2924/00

Abstract: A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.

Abstract translation: 一种用于密封电子部件的粘合性优异的电子部件的热固性树脂片材; 高可靠性的树脂密封型半导体器件; 并提供一种制造该装置的方法。 本发明涉及一种用于密封电子部件的热固性树脂片，其包含一种或多种树脂成分，其中一种成分可以是热塑性树脂，并且通过使热塑性树脂的含量百分比为30％以下，通过 所有树脂组分的重量。

公开(公告)号：US20140061955A1

公开(公告)日：2014-03-06

申请号：US13973863

申请日：2013-08-22

Applicant: NITTO DENKO CORPORATION

Inventor： Yusaku Shimizu ,  Takeshi Matsumura ,  Eiji Toyoda ,  Tsuyoshi Torinari ,  Daisuke Uenda

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/293 ,  H01L21/56 ,  H01L2924/0002 ,  Y10T428/31663 ,  Y10T428/31678 ,  H01L2924/00

Abstract: A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.

Abstract translation: 一种用于密封电子部件的粘合性优异的电子部件的热固性树脂片材; 高可靠性的树脂密封型半导体器件; 并提供一种制造该装置的方法。 本发明涉及一种用于密封电子部件的热固性树脂片，其包含一种或多种树脂成分，其中一种成分可以是热塑性树脂，并且通过使热塑性树脂的含量百分比为30％以下，通过 所有树脂组分的重量。

公开(公告)号：US20140004683A1

公开(公告)日：2014-01-02

申请号：US13924420

申请日：2013-06-21

Applicant: NITTO DENKO CORPORATION

Inventor： Shinya Akizuki ,  Toshimasa Sugimura ,  Daisuke Uenda ,  Takeshi Matsumura

IPC: H01L21/58

CPC classification number: H01L21/2007 ,  H01L21/02002 ,  H01L21/0495 ,  H01L21/6835 ,  H01L33/0079 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/0001

Abstract: A method of manufacturing a semiconductor element is provided. The method includes the steps of: bonding a substrate for transferring and a functional layer that is formed on a substrate for forming a functional layer with a temporary fixing layer interposed therebetween; removing the substrate for forming a functional layer to expose the functional layer; bonding a final substrate to the exposed functional layer; and separating the temporary fixing layer and the substrate for transferring from the functional layer, wherein the temporary fixing layer has (A) a specific shear adhering strength or has (B) a specific weight loss rate.

Abstract translation: 提供一种制造半导体元件的方法。 该方法包括以下步骤：将用于转印的基板和形成在用于形成功能层的基板上形成的功能层与其间插入临时固定层的方法相结合; 去除用于形成功能层的基板以暴露功能层; 将最终的基底粘合到暴露的功能层; 并且从功能层分离临时固定层和用于转移的基板，其中临时固定层具有（A）特定的剪切粘合强度或具有（B）比重损失率。

公开(公告)号：US20140249269A1

公开(公告)日：2014-09-04

申请号：US14348947

申请日：2012-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Daisuke Uenda ,  Yusuke Shirakawa ,  Hiroshi Hamamoto ,  Takashi Oda ,  Eiji Toyoda ,  Takeshi Matsumura

IPC: C09D177/06

CPC classification number: C08G73/1082 ,  C08G73/1042 ,  C08G73/105 ,  C09D5/20 ,  C09D179/08

Abstract: In order to provide a thermally-detachable sheet that detaches at higher temperatures, this thermally-detachable sheet has a shear bond strength with respect to a silicon wafer of 0.25 kg/5×5 mm or larger, at a temperature of 200° C., after said temperature has been maintained for one minute, and a shear bond strength with respect to a silicon wafer of 0.25 kg/less than 5×5 mm at any temperature in a range of over 200° C. to not more than 500° C., after said temperature has been maintained for three minutes.

Abstract translation: 为了提供在较高温度下分离的可热拆卸的片材，该热分解片材在200℃的温度下具有相对于硅晶片的剪切粘合强度为0.25kg / 5×5mm或更大。 在超过200℃至不超过500℃的任何温度下，在所述温度保持1分钟之后，相对于硅晶片的剪切粘合强度为0.25kg /小于5×5mm 在所述温度保持3分钟之后。

公开(公告)号：US20140004637A1

公开(公告)日：2014-01-02

申请号：US13917330

申请日：2013-06-13

Applicant: NITTO DENKO CORPORATION

Inventor： Tomokazu Takahashi ,  Shinya Akizuki ,  Toshimasa Sugimura ,  Takeshi Matsumura ,  Daisuke Uenda

IPC: H01L33/46

CPC classification number: H01L33/46 ,  H01L21/6836 ,  H01L33/0079 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.

Abstract translation: 根据本发明的实施例的制造LED的方法包括：背面研磨包括所述基板的LED晶片的基板和形成在所述基板的一个表面上的发光元件; 在后研磨之后，在基板的外侧上形成反射层; 并且在所述LED晶片的发光元件的外侧附着耐热粘合片。