公开(公告)号：US20240343949A1

公开(公告)日：2024-10-17

申请号：US18294708

申请日：2021-12-16

Applicant: NITTO DENKO CORPORATION

Inventor： Kazumichi KATO ,  Shusaku UENO ,  Takamasa HIRAYAMA

IPC: C09J7/38 ,  C09J133/08

CPC classification number: C09J7/385 ,  C09J133/08 ,  C09J2203/326 ,  C09J2301/312 ,  C09J2467/006

Abstract: A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer of which adhesive face has wettability difficult to change even when exposed to an atmospheric environment, and on which positional deviation or drop is difficult to occur in conveying an electronic component. The pressure-sensitive adhesive layer has an adhesive face protected by a release liner and has a displacement of water contact angles θ1 and θ2 against the adhesive face 10a under the following conditions T1 and T2 of 5° or less:



T1: immediately after separating the release liner R1 under an environment of 23° C.
T2: after 2 hour exposure of the adhesive face 10a to an atmospheric environment after separating the release liner R1 under an environment of 23° C.
θ1: water contact angle (°) of the adhesive face 10a under T1
θ2: water contact angle (°) of the adhesive face 10a under T2






Displacement R(°)=θ2−θ1.

公开(公告)号：US20220059391A1

公开(公告)日：2022-02-24

申请号：US17421059

申请日：2020-01-15

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku UENO ,  Takamasa HIRAYAMA ,  Makoto AKAI

IPC: H01L21/683 ,  C09J5/00 ,  C09J7/38

Abstract: Provided is a method of manufacturing an electronic part including fixing a hard and brittle substrate to a support and separating the hard and brittle substrate from the support, the method being capable of preventing the hard and brittle substrate from being damaged during the separation of the hard and brittle substrate from the support. The method of manufacturing an electronic part of the present invention is a method of manufacturing an electronic part including processing a workpiece fixed onto a support, the method including: fixing the workpiece by arranging at least one heat-peelable layer between the support and the workpiece; processing a surface of the fixed workpiece on an opposite side to the heat-peelable layer; and separating the workpiece from the support by heating the heat-peelable layer after the processing.

公开(公告)号：US20220372349A1

公开(公告)日：2022-11-24

申请号：US17785254

申请日：2020-11-30

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku UENO ,  Takamasa HIRAYAMA

IPC: C09J133/08 ,  C09J7/38 ,  C09J7/40 ,  C08F220/18 ,  C08F220/06 ,  C08K5/1515 ,  C08K5/29

Abstract: Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1): Log(Er(gas)×106)≥8.01×h(gas)−0.116  (1). In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.

公开(公告)号：US20210309890A1

公开(公告)日：2021-10-07

申请号：US17269592

申请日：2019-08-19

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku UENO ,  Takumi YUTOU ,  Takamasa HIRAYAMA

IPC: C09J7/38 ,  C09J131/04 ,  C09J125/10 ,  C09J153/02 ,  C09J11/08 ,  H01L21/304 ,  H01L21/683 ,  B24B7/22

Abstract: Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of low contamination property, productivity, grinding accuracy, and peelability. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a thickness of from 1 μm to 300 μm, and wherein a microhardness H (Pa) of the pressure-sensitive adhesive layer at 25° C. and the thickness, which is represented by hA (μm), of the pressure-sensitive adhesive layer satisfy a relationship represented by the following expression (1). log H≥1.9385×log hA+4.2611 . . . (1)

公开(公告)号：US20240376351A1

公开(公告)日：2024-11-14

申请号：US18691609

申请日：2022-03-30

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku UENO ,  Kazumichi KATO ,  Takamasa HIRAYAMA

IPC: C09J7/38 ,  C09J11/04 ,  C09J133/06

Abstract: Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation.

公开(公告)号：US20230026069A1

公开(公告)日：2023-01-26

申请号：US17787123

申请日：2020-11-30

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku UENO ,  Takamasa HIRAYAMA

IPC: C09J7/38 ,  B32B27/30 ,  H01L21/30 ,  C09J5/00

Abstract: A pressure-sensitive adhesive sheet capable of allowing a small electronic part to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet includes: a gas-generating layer; and a gas barrier layer arranged on at least one side of the gas-generating layer, wherein the gas barrier layer is a layer that is deformed through laser light irradiation of the pressure-sensitive adhesive sheet, wherein a thickness (μm) of a highly elastic portion of the gas barrier layer is equal to or smaller than a value calculated by the following expression (1), and wherein the thickness (μm) of the highly elastic portion of the gas barrier layer is equal to or larger than a value calculated by the following expression (2): 12546×EXP(−0.728×log10(Er×106)) . . . (1); 18096×EXP(−0.949×log10(Er×106)) . . . (2), where Er represents a modulus of elasticity (MPa) of the highly elastic portion of the gas barrier layer by a nanoindentation method at 25° C.

公开(公告)号：US20210309889A1

公开(公告)日：2021-10-07

申请号：US17269580

申请日：2019-08-19

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku UENO ,  Takumi YUTOU ,  Takamasa HIRAYAMA

IPC: C09J7/38 ,  C09J11/06 ,  C09J11/08 ,  C09J125/10 ,  C09J153/02 ,  H01L21/683 ,  C08J9/32

Abstract: Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of grinding accuracy, low contamination property, productivity, and fixing property. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains: a pressure-sensitive adhesive containing a base polymer; and a foaming agent having a foaming temperature of 90° C. or more, and wherein the pressure-sensitive adhesive sheet has, when a pressure-sensitive adhesive surface thereof is bonded to a silicon chip, a shear adhesive strength of 1.0 MPa or more under an ambient temperature of 25° C., and a shear adhesive strength of 0.2 MPa or more under an ambient temperature of 80° C.