公开(公告)号：US20240341033A1

公开(公告)日：2024-10-10

申请号：US18625662

申请日：2024-04-03

Applicant: IBIDEN CO., LTD.

Inventor： Masashi KUWABARA ,  Susumu KAGOHASHI

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K3/4038 ,  H05K2201/0245 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/06

Abstract: A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor layers. The minimum inter-wiring distance of the wirings in the first conductor layers is smaller than the minimum inter-wiring distance of the wirings in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer. The first layer of each via conductor is covering inner wall surface in a via opening and has a first portion and a second portion. The first portion has a portion formed closer to the center of the via opening than the second portion.

公开(公告)号：US11882651B2

公开(公告)日：2024-01-23

申请号：US17612985

申请日：2020-05-13

Applicant: SIGNIFY HOLDING B.V.

Inventor： Rifat Ata Mustafa Hikmet ,  Ties Van Bommel ,  Grigory Onushkin

IPC: H05K1/02 ,  F21V29/503 ,  F21V19/00 ,  H05K1/05 ,  F21Y115/10

CPC classification number: H05K1/0274 ,  F21V19/0025 ,  F21V29/503 ,  H05K1/0203 ,  H05K1/056 ,  F21Y2115/10 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: The invention provides a lighting device (1000) comprising (i) a light source (100) configured to generate light source light (101), wherein the light source (100) comprises a solid state light source, and (ii) a support (200) configured to support the light source (100), wherein the support (200) comprises a metal based thermally conductive material (201), wherein the lighting device (1000) further comprises (iii) a layered element (300), configured in physical contact with the support (200), wherein the layered element (300) comprises one or more layers (310), wherein the layered element (300) at least comprises an electrically insulating first layer (311), wherein at least part of the layered element (300) is configured between the light source (100) and the support (200) such that during operation part of the light source light (101) irradiates the layered element (300), wherein the layered element (300) comprises light reflective particles (410), wherein at least 50 wt. % of the particles have a flake-like shape.

公开(公告)号：US11849540B2

公开(公告)日：2023-12-19

申请号：US17728567

申请日：2022-04-25

Applicant: THE GOVERNORS OF THE UNIVERSITY OF ALBERTA

Inventor： Hyun-Joong Chung ,  Jana Rieger ,  Thanh-Giang La ,  Shide Qiu ,  Dylan Scott

IPC: H05K1/03 ,  H05K3/12 ,  H05K1/02 ,  A61B5/296 ,  A61B5/0205 ,  A61B5/00 ,  C09D11/10 ,  H05K1/09 ,  A61B5/291 ,  A61B5/297 ,  A61B5/28 ,  A61B5/0245 ,  A61B5/08 ,  C08K3/08

CPC classification number: H05K1/0283 ,  A61B5/02055 ,  A61B5/296 ,  A61B5/6804 ,  C09D11/10 ,  H05K1/095 ,  H05K3/125 ,  A61B5/0245 ,  A61B5/0816 ,  A61B5/28 ,  A61B5/291 ,  A61B5/297 ,  A61B2562/0209 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/164 ,  A61B2562/166 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/038 ,  H05K2201/0116 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0278 ,  H05K2201/09263 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are ‘wetted’ with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

公开(公告)号：US20230180384A1

公开(公告)日：2023-06-08

申请号：US17995309

申请日：2021-02-26

Applicant: SHIN-ETSU POLYMER CO., LTD.

Inventor： Kazuyoshi YOSHIDA ,  Wataru KATAGIRI

IPC: H05K1/03 ,  C23C14/20 ,  C23C14/34

CPC classification number: H05K1/0373 ,  C23C14/205 ,  C23C14/34 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2201/0245 ,  H05K2201/0209

Abstract: There is provided a metal-clad laminate in which the transmission loss of electrical signals can be reduced, a finer pitch of a circuit pattern is possible, a high precision and fine circuit can be formed, and the close adhesiveness of the metal film is excellent. The metal-clad laminate includes a coating film and a metal film laminated on a base material film in this order, wherein the metal film is a metal film formed by at least any formation method of plating, sputtering, and vapor deposition, and a surface roughness (Rz) of the coating film is 1 μm or less.

公开(公告)号：US09949376B2

公开(公告)日：2018-04-17

申请号：US14563778

申请日：2014-12-08

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J Greenberg ,  Neil H Talbot ,  James S Little

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36 ,  A61N1/372 ,  H05K3/28 ,  H05K1/11 ,  H05K1/14 ,  A61B5/00 ,  A61B5/0478 ,  H05K1/18 ,  H01L23/055 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/282 ,  A61B5/0006 ,  A61B5/0478 ,  A61B5/4836 ,  A61B5/6868 ,  A61B2562/0209 ,  A61B2562/046 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/3606 ,  A61N1/36071 ,  A61N1/36082 ,  A61N1/36139 ,  A61N1/375 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/005 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4061 ,  H05K2201/0245 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/10795 ,  H05K2201/10931 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/068 ,  H05K2203/082 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/1394 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

公开(公告)号：US09947432B2

公开(公告)日：2018-04-17

申请号：US14876297

申请日：2015-10-06

Applicant: FLEXcon Company, Inc.

Inventor： Kenneth Burnham ,  Richard Skov

IPC: H01B1/22 ,  H01B1/24 ,  C09J9/02 ,  H05K1/09 ,  B82Y30/00

CPC classification number: H01B1/24 ,  B82Y30/00 ,  C09J9/02 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/105 ,  H05K2203/1136

Abstract: A method of forming an electrically conductive composite is disclosed that includes the steps of providing a first dielectric material and a second conductive material that is substantially dispersed within the first dielectric material; and applying an electric field through at least a portion of the combined first dielectric material and second conductive material such that the second conductive material undergoes electrophoresis and forms at least one electrically conductive path through the electrically conductive composite along the direction of the applied electric field.

公开(公告)号：US20180103544A1

公开(公告)日：2018-04-12

申请号：US15287563

申请日：2016-10-06

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey ,  Andrew L. Fassler

IPC: H05K1/03 ,  C09D183/04 ,  C09D5/24 ,  C08K7/00 ,  C08K3/08 ,  H01L23/538 ,  G06F1/16 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0393 ,  C08K3/08 ,  C08K7/00 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/011 ,  C09D5/24 ,  C09D183/04 ,  G06F1/1669 ,  H01L23/5386 ,  H01L23/5387 ,  H05K1/028 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/148 ,  H05K3/0014 ,  H05K3/285 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0391 ,  H05K2203/0776

Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

公开(公告)号：US20180072897A1

公开(公告)日：2018-03-15

申请号：US15558956

申请日：2016-03-18

Applicant: LOUGHBOROUGH UNIVERSITY

Inventor： Mark Andrew ASHWORTH ,  Helen Elizabeth PEARSON ,  Xujin BAO ,  Geoffrey David WILCOX

IPC: C09D7/12 ,  C09D5/00 ,  C09D175/04 ,  H05K3/28

CPC classification number: C09D7/70 ,  C08K3/346 ,  C08K7/00 ,  C08K9/02 ,  C08K9/04 ,  C08K2201/004 ,  C08K2201/005 ,  C08K2201/011 ,  C09D5/00 ,  C09D7/61 ,  C09D7/62 ,  C09D175/04 ,  H05K1/0373 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0769 ,  H05K2201/09872

Abstract: A nanocomposite coating composition for use in the mitigation of whisker growth from a metallic surface (82) includes a polymer matrix (86) comprising a base polymer and insulating material nanoplatelets (85), for example clay nanoplatelets, within the polymer matrix (86). A conformal coating (84) for application to a metal surface (82) is formed from the coating composition. The conformal coating mitigates the spontaneous growth of whiskers (83), in particular tin whiskers, from the coated surface (82), reducing the risk of short-circuits caused by such whiskers bridging gaps within electronic devices. Methods are provided for the preparation of coating compositions and coatings.

公开(公告)号：US09833802B2

公开(公告)日：2017-12-05

申请号：US14736040

申请日：2015-06-10

Applicant: PULSE FINLAND OY

Inventor： Esa Kalistaja ,  Elli Galla ,  Dan Kuehler ,  Winthrop Childers

IPC: H05K1/00 ,  B05B12/04 ,  H05K3/12 ,  B05B17/04 ,  B05D1/28 ,  H05K1/11 ,  H05K3/14

CPC classification number: B05B12/04 ,  B05B17/04 ,  B05D1/28 ,  H05K1/111 ,  H05K3/12 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0245 ,  H05K2201/0391 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2203/1366 ,  H05K2203/1476

Abstract: A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets, and methods of, and apparatus for, forming the same. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a complex (3D) conductive trace is formed using two or more different print technologies via creation of different domains within the conductive trace pattern.

公开(公告)号：US09756718B2

公开(公告)日：2017-09-05

申请号：US14160962

申请日：2014-01-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji Kataoka ,  Koichi Kanryo

IPC: H05K1/02 ,  H05K3/28 ,  H01L23/00

CPC classification number: H05K1/0216 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/0715 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A module board includes a base substrate. Electronic components are mounted on a first principal surface of the base substrate. The mounted electronic components are sealed by a sealing resin containing an SiO2 filler. A top surface and side surfaces of the sealing resin are covered with a shield layer containing a carbon filler, which is flat powder, as a conductive component. A terminal electrode is formed on a second principal surface of the base substrate that is disposed opposite to the first principal surface of the base substrate.