公开(公告)号：US11906451B2

公开(公告)日：2024-02-20

申请号：US17448081

申请日：2021-09-20

Applicant: Nova Ltd. ,  GLOBALFOUNDRIES U.S. INC.

Inventor： Wei Ti Lee ,  Heath A. Pois ,  Mark Klare ,  Cornel Bozdog ,  Alok Vaid

IPC: G01N23/2273 ,  H01L21/66 ,  G01B11/06 ,  G01B15/02 ,  G01N23/2208 ,  G01N23/223

CPC classification number: G01N23/2273 ,  G01B11/06 ,  G01B15/02 ,  G01N23/223 ,  G01N23/2208 ,  H01L22/12 ,  G01N2223/305 ,  G01N2223/61 ,  G01N2223/633

Abstract: A monitoring system and method are provided for determining at least one property of an integrated circuit (IC) comprising a multi-layer structure formed by at least a layer on top of an underlayer. The monitoring system receives measured data comprising data indicative of optical measurements performed on the IC, data indicative of x-ray photoelectron spectroscopy (XPS) measurements performed on the IC and data indicative of x-ray fluorescence spectroscopy (XRF) measurements performed on the IC. An optical data analyzer module analyzes the data indicative of the optical measurements and generates geometrical data indicative of one or more geometrical parameters of the multi-layer structure formed by at least the layer on top of the underlayer. An XPS data analyzer module analyzes the data indicative of the XPS measurements and generates geometrical and material related data indicative of geometrical and material composition parameters for said layer and data indicative of material composition of the underlayer. An XRF data analyzer module analyzes the data indicative of the XRF measurements and generates data indicative of amount of a predetermined material composition in the multi-layer structure. A data interpretation module generates combined data received from analyzer modules and processes the combined data and determines the at least one property of at least one layer of the multi-layer structure.

公开(公告)号：US11885737B2

公开(公告)日：2024-01-30

申请号：US17135924

申请日：2020-12-28

Applicant: NOVA LTD.

Inventor： Dror Shafir ,  Gilad Barak ,  Shay Wolfling ,  Michal Haim Yachini ,  Matthew Sendelbach ,  Cornel Bozdog

IPC: G01N21/21 ,  G01N21/47

CPC classification number: G01N21/21 ,  G01N21/211 ,  G01N2021/4792 ,  G01N2201/061 ,  G01N2201/0683

Abstract: A method and system are presented for use in measuring on patterned samples, aimed at determining asymmetry in the pattern. A set of at least first and second measurements on a patterned region of a sample is performed, where each of the measurements comprises: directing illuminating light onto the patterned region along an illumination channel and collecting light reflected from the illuminated region propagating along a collection channel to be detected, such that detected light from the same patterned region has different polarization states which are different from polarization of the illuminating light, and generating a measured data piece indicative of the light detected in the measurement. Thus, at least first and second measured data pieces are generated for the at least first and second measurements on the same patterned region. The at least first and second measured data pieces are analyzed and output data is generated being indicative of a condition of asymmetry in the patterned region.

公开(公告)号：US20220074878A1

公开(公告)日：2022-03-10

申请号：US17448081

申请日：2021-09-20

Applicant: Nova Ltd. ,  GLOBALFOUNDRIES U.S. INC.

Inventor： Wei Lee ,  Heath A. Pois ,  Mark Klare ,  Cornel Bozdog ,  Alok Vaid

IPC: G01N23/2273 ,  H01L21/66 ,  G01B11/06 ,  G01B15/02 ,  G01N23/2208 ,  G01N23/223

Abstract: A monitoring system and method are provided for determining at least one property of an integrated circuit (IC) comprising a multi-layer structure formed by at least a layer on top of an underlayer. The monitoring system receives measured data comprising data indicative of optical measurements performed on the IC, data indicative of x-ray photoelectron spectroscopy (XPS) measurements performed on the IC and data indicative of x-ray fluorescence spectroscopy (XRF) measurements performed on the IC. An optical data analyzer module analyzes the data indicative of the optical measurements and generates geometrical data indicative of one or more geometrical parameters of the multi-layer structure formed by at least the layer on top of the underlayer. An XPS data analyzer module analyzes the data indicative of the XPS measurements and generates geometrical and material related data indicative of geometrical and material composition parameters for said layer and data indicative of material composition of the underlayer. An XRF data analyzer module analyzes the data indicative of the XRF measurements and generates data indicative of amount of a predetermined material composition in the multi-layer structure. A data interpretation module generates combined data received from analyzer modules and processes the combined data and determines the at least one property of at least one layer of the multi-layer structure.