公开(公告)号：US11710616B2

公开(公告)日：2023-07-25

申请号：US17722421

申请日：2022-04-18

Applicant: NOVA LTD

Inventor： Vladimir Machavariani ,  Michael Shifrin ,  Daniel Kandel ,  Victor Kucherov ,  Igor Ziselman ,  Ronen Urenski ,  Matthew Sendelbach

IPC: H01J37/26 ,  G06T7/00 ,  G06T7/60 ,  H01J37/22 ,  G06T15/20 ,  G06T7/246

CPC classification number: H01J37/26 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/251 ,  G06T7/60 ,  G06T15/205 ,  H01J37/222 ,  G06T2207/10061 ,  G06T2207/20076 ,  H01J2237/221 ,  H01J2237/24592

Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.

公开(公告)号：US11450541B2

公开(公告)日：2022-09-20

申请号：US16650405

申请日：2018-08-29

Applicant: NOVA LTD.

Inventor： Vladimir Machavariani ,  Michael Shifrin ,  Daniel Kandel ,  Victor Kucherov ,  Igor Ziselman ,  Ronen Urenski ,  Matthew Sendelbach

IPC: H01L21/67 ,  G01B15/02 ,  G05B13/04 ,  G01N23/04 ,  G01N23/06

Abstract: A metrology method for use in determining one or more parameters of a patterned structure, the method including providing raw measured TEM image data, TEMmeas, data indicative of a TEM measurement mode, and predetermined simulated TEM image data including data indicative of one or more simulated TEM images of a structure similar to the patterned structure under measurements and a simulated weight map including weights assigned to different regions in the simulated TEM image corresponding to different features of the patterned structure, performing a fitting procedure between the raw measured TEM image data and the predetermined simulated TEM image data and determining one or more parameters of the structure from the simulated TEM image data corresponding to a best fit condition.

公开(公告)号：US11309162B2

公开(公告)日：2022-04-19

申请号：US17170938

申请日：2021-02-09

Applicant: NOVA LTD.

Inventor： Vladimir Machavariani ,  Michael Shifrin ,  Daniel Kandel ,  Victor Kucherov ,  Igor Ziselman ,  Ronen Urenski ,  Matthew Sendelbach

IPC: H01J37/26 ,  G06T7/00 ,  G06T7/60 ,  H01J37/22 ,  G06T15/20 ,  G06T17/05 ,  G06T7/246 ,  G06T19/00

Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.