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公开(公告)号：US10649147B2
公开(公告)日：2020-05-12
申请号：US16099955
申请日：2017-05-12
发明人： Tomohiro Nakanishi , Teruaki Sato , Motohaya Ishii , Satoru Konno , Yuichi Suzuki , Shigeo Nagashima , Shinji Mino , Shuichiro Asakawa , Hiroshi Fukuda , Shin Kamei , Shunichi Soma , Ken Tsuzuki , Mitsuo Usui , Takashi Saida
IPC分类号： G02B6/30
摘要： An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
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公开(公告)号：US11307356B2
公开(公告)日：2022-04-19
申请号：US16957259
申请日：2018-12-19
发明人： Yuichi Suzuki , Tomohiro Nakanishi , Motoki Minami , Hiroshi Tomita , Motohaya Ishii , Shuichiro Asakawa , Shunichi Soma
摘要： An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.
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公开(公告)号：US10908356B2
公开(公告)日：2021-02-02
申请号：US16346182
申请日：2017-11-02
发明人： Tomohiro Nakanishi , Motoki Minami , Satoru Konno , Yuichi Suzuki , Teruaki Sato , Shigeo Nagashima , Shinji Mino , Motohaya Ishii , Shunichi Soma , Shin Kamei , Shuichiro Asakawa
摘要： An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.
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公开(公告)号：US20190353844A1
公开(公告)日：2019-11-21
申请号：US16099955
申请日：2017-05-12
发明人： Tomohiro Nakanishi , Teruaki Sato , Motohaya Ishii , Satoru Konno , Yuichi Suzuki , Shigeo Nagashima , Shinji Mino , Shuichiro Asakawa , Hiroshi Fukuda , Shin Kamei , Shunichi Soma , Ken Tsuzuki , Mitsuo Usui , Takashi Saida
IPC分类号： G02B6/30
摘要： An optical module which is connectable to an optical fiber array and which can be packaged in a high density. Two 30 mm square package modules are mounted on a board, and optical waveguides in a 20 mm square Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block (15×10 mm). Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. In the embodiment, the optical waveguides in the Si photonic lightwave circuit are tilted at an appropriate angle, for example, 20 degrees with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted at 20 degrees with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
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公开(公告)号：US11199659B2
公开(公告)日：2021-12-14
申请号：US15734873
申请日：2019-05-17
IPC分类号： G02B6/26
摘要： An optical module according to the present invention includes: a first plasmonic waveguide having one end formed of a first metal layer formed over an end portion of a first substrate, and having another end connected to one end of a first optical waveguide; a second metal layer that is formed on a side surface continuous with the end portion of the first substrate and formed to be continuous with the first metal layer; a second substrate provided with a second plasmonic waveguide formed of a third metal layer; and a second optical waveguide that is connected to the second plasmonic waveguide and formed on the second substrate, wherein the second metal layer and a part of the third metal layer are joined together to connect the first substrate to the second substrate.
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公开(公告)号：US20210364711A1
公开(公告)日：2021-11-25
申请号：US17043529
申请日：2019-03-25
IPC分类号： G02B6/42
摘要： To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.
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公开(公告)号：US20210247575A1
公开(公告)日：2021-08-12
申请号：US16972872
申请日：2019-05-23
IPC分类号： G02B6/42
摘要： Provided is an optical fiber connection component in which an optical waveguide of a planar lightwave circuit and an optical fiber can be connected after a process using SMT and reflow mounting technology. The optical fiber connection component includes: a plurality of fiber guide holes into which optical fibers are insertable at intervals equal to intervals of a plurality of optical waveguides of the planar lightwave circuit; and grooves for demarcating an area provided with the plurality of fiber guide holes and an area coated with an adhesive in an end surface to be joined with the planar lightwave circuit. The plurality of optical waveguides and the plurality of fiber guide holes are respectively aligned and fixed to the planar lightwave circuit with the adhesive in advance.
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公开(公告)号：US11561350B2
公开(公告)日：2023-01-24
申请号：US17043529
申请日：2019-03-25
IPC分类号： G02B6/42
摘要： To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.
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公开(公告)号：US11422321B2
公开(公告)日：2022-08-23
申请号：US16972872
申请日：2019-05-23
摘要： Provided is an optical fiber connection component in which an optical waveguide of a planar lightwave circuit and an optical fiber can be connected after a process using SMT and reflow mounting technology. The optical fiber connection component includes: a plurality of fiber guide holes into which optical fibers are insertable at intervals equal to intervals of a plurality of optical waveguides of the planar lightwave circuit; and grooves for demarcating an area provided with the plurality of fiber guide holes and an area coated with an adhesive in an end surface to be joined with the planar lightwave circuit. The plurality of optical waveguides and the plurality of fiber guide holes are respectively aligned and fixed to the planar lightwave circuit with the adhesive in advance.
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公开(公告)号：US09297961B2
公开(公告)日：2016-03-29
申请号：US14391278
申请日：2013-04-24
发明人： Kota Shikama , Shuichiro Asakawa , Atushi Aratake , Ken Tsuzuki , Shinji Mino
CPC分类号： G02B6/30 , G02B6/00 , G02B6/12004 , G02B6/1203 , G02B6/125 , G02B6/4267 , G02B2006/1204 , G02B2006/12119 , G02B2006/12142 , G02F1/011 , G02F2001/0113
摘要： Even in the case of an optical module including a multi-chip integrated device, an optical module having a smaller size in consideration of the connection to optical fibers. An optical module having a package containing a multi-chip integrated device integrated with an optical functional element having both ends connected to planar lightwave circuits (PLCs) is provided. Each of the PLCs includes a folded waveguide for connecting a light waveguide formed in the optical functional element to optical fibers. The optical module comprises a connecting part connected to each of the PLCs for connecting the optical functional element to the optical fibers in the same face. The optical fibers are taken out from opposed surfaces of the package.
摘要翻译： 即使在包括多芯片集成装置的光学模块的情况下，考虑到与光纤的连接，具有较小尺寸的光学模块。 提供一种光学模块，其具有包含与具有连接到平面光波电路（PLC）的两端的光功能元件集成的多芯片集成器件的封装。 每个PLC包括用于将形成在光功能元件中的光波导连接到光纤的折叠波导。 光学模块包括连接到每个PLC的连接部分，用于将光学功能元件连接到相同面部中的光纤。 光纤从包装的相对表面取出。
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