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公开(公告)号：US10649147B2
公开(公告)日：2020-05-12
申请号：US16099955
申请日：2017-05-12
发明人： Tomohiro Nakanishi , Teruaki Sato , Motohaya Ishii , Satoru Konno , Yuichi Suzuki , Shigeo Nagashima , Shinji Mino , Shuichiro Asakawa , Hiroshi Fukuda , Shin Kamei , Shunichi Soma , Ken Tsuzuki , Mitsuo Usui , Takashi Saida
IPC分类号： G02B6/30
摘要： An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
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公开(公告)号：US20190353844A1
公开(公告)日：2019-11-21
申请号：US16099955
申请日：2017-05-12
发明人： Tomohiro Nakanishi , Teruaki Sato , Motohaya Ishii , Satoru Konno , Yuichi Suzuki , Shigeo Nagashima , Shinji Mino , Shuichiro Asakawa , Hiroshi Fukuda , Shin Kamei , Shunichi Soma , Ken Tsuzuki , Mitsuo Usui , Takashi Saida
IPC分类号： G02B6/30
摘要： An optical module which is connectable to an optical fiber array and which can be packaged in a high density. Two 30 mm square package modules are mounted on a board, and optical waveguides in a 20 mm square Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block (15×10 mm). Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. In the embodiment, the optical waveguides in the Si photonic lightwave circuit are tilted at an appropriate angle, for example, 20 degrees with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted at 20 degrees with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
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公开(公告)号：US10908356B2
公开(公告)日：2021-02-02
申请号：US16346182
申请日：2017-11-02
发明人： Tomohiro Nakanishi , Motoki Minami , Satoru Konno , Yuichi Suzuki , Teruaki Sato , Shigeo Nagashima , Shinji Mino , Motohaya Ishii , Shunichi Soma , Shin Kamei , Shuichiro Asakawa
摘要： An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.
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公开(公告)号：US10277271B2
公开(公告)日：2019-04-30
申请号：US15744193
申请日：2016-07-27
发明人： Kiyofumi Kikuchi , Hiroshi Fukuda , Takashi Saida , Shin Kamei , Ken Tsuzuki
IPC分类号： H04B3/32 , H01S5/022 , H01P3/08 , H01R13/6466 , H05K1/02
摘要： An optical module that suppresses crosstalk between high-frequency transmission lines includes at least one set of: an optical port; an optical processing circuit optically connected to the optical port; an electro-optical transducer optically connected to the optical processing circuit; two or more high-frequency transmission lines connected to the electro-optical transducer; and electrical ports connected to the high-frequency transmission lines, and includes a conductive cover block which is provided above the high-frequency transmission lines so as to at least partly cover the high-frequency transmission lines and which is grounded.
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公开(公告)号：US10146099B2
公开(公告)日：2018-12-04
申请号：US15528874
申请日：2015-12-08
发明人： Ken Tsuzuki , Shin Kamei , Makoto Jizodo
摘要： The present invention provides an optical modulator including a substrate and a phase modulation portion on the substrate. The phase modulation portion includes an optical waveguide comprised of a first clad layer, a semiconductor layer that is laminated on the first clad layer and has a refraction index higher than the first clad layer and a second clad layer that is laminated on the semiconductor layer and has a refraction index lower than the semiconductor layer, a first traveling wave electrode, and a second traveling wave electrode. The semiconductor layer includes a rib that is formed in the optical waveguide in an optical axis direction and is a core of the optical waveguide, a first slab that is formed in the optical axis direction in one side of the rib, a second slab that is formed in the optical axis direction in the other side of the rib, a third slab that is formed in the first slab in the optical axis direction at the opposite side to the rib, and a fourth slab that is formed in the second slab in the optical axis direction at the opposite side to the rib. The first slab is formed to be thinner than the rib and the third slab, and the second slab is formed to be thinner than the rib and the fourth slab.
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公开(公告)号：US20180199445A1
公开(公告)日：2018-07-12
申请号：US15735726
申请日：2016-06-17
发明人： Mitsuo Usui , Kiyofumi Kikuchi , Ken Tsuzuki , Hiroshi Fukuda , Shuichiro Asakawa , Shin Kamei , Shunichi Soma , Takashi Saida
摘要： In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards, and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved.
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公开(公告)号：US20180198483A1
公开(公告)日：2018-07-12
申请号：US15744193
申请日：2016-07-27
发明人： Kiyofumi Kikuchi , Hiroshi Fukuda , Takashi Saida , Shin Kamei , Ken Tsuzuki
IPC分类号： H04B3/32 , H01R13/6466 , H01P3/08 , H05K1/02
CPC分类号： H04B3/32 , H01P3/081 , H01R13/6466 , H01S5/022 , H05K1/0228
摘要： An optical module that suppresses crosstalk between high-frequency transmission lines includes at least one set of: an optical port; an optical processing circuit optically connected to the optical port; an electro-optical transducer optically connected to the optical processing circuit; two or more high-frequency transmission lines connected to the electro-optical transducer; and electrical ports connected to the high-frequency transmission lines, and includes a conductive cover block which is provided above the high-frequency transmission lines so as to at least partly cover the high-frequency transmission lines and which is grounded.
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公开(公告)号：US20160087727A1
公开(公告)日：2016-03-24
申请号：US14889127
申请日：2014-05-09
发明人： Munehiko Nagatani , Hideyuki Nosaka , Toshihiro Itoh , Koichi Murata , Hiroyuki Fukuyama , Takashi Saida , Shin Kamei , Hiroshi Yamazaki , Nobuhiro Kikuchi , Hiroshi Koizumi , Masafumi Nogawa , Hiroaki Katsurai , Hiroyuki Uzawa , Tomoyoshi Kataoka , Naoki Fujiwara , Hiroto Kawakami , Kengo Horikoshi , Yves Bouvier , Mikio Yoneyama , Shigeki Aisawa , Masahiro Suzuki
CPC分类号： H04B10/541 , H03F1/223 , H03F1/32 , H03F3/04 , H03F3/082 , H03F3/195 , H03F3/245 , H03F3/45085 , H03F3/45089 , H03F3/45183 , H03F3/45188 , H03F3/602 , H03F2200/18 , H03F2200/219 , H03F2200/255 , H03F2200/27 , H03F2200/336 , H03F2200/411 , H03F2200/72 , H03F2200/75 , H03F2203/45258 , H03F2203/45374 , H03F2203/45392 , H03F2203/45454 , H03F2203/45466 , H03F2203/45471 , H03F2203/45486 , H03F2203/45496 , H03F2203/45504 , H03F2203/45506 , H03F2203/45702 , H03G1/0023 , H03G1/0082 , H03G1/0088 , H03G3/00 , H03G3/001 , H03G3/3084 , H04B10/5561 , H04B10/588
摘要： An optical modulator driver circuit (1) includes an amplifier (50, Q10, Q11, R10-R13), and a current amount adjustment circuit (51) capable of adjusting a current amount of the amplifier (50) in accordance with a desired operation mode. The current amount adjustment circuit (51) includes at least two current sources (IS10) that are individually ON/OFF-controllable in accordance with a binary control signal representing the desired operation mode.
摘要翻译： 光调制器驱动电路（1）包括放大器（50，Q10，Q11，R10-R13）和电流量调节电路（51），能够根据期望的操作调节放大器（50）的电流量 模式。 电流量调节电路（51）包括至少两个根据表示期望的操作模式的二进制控制信号单独地进行ON / OFF控制的电流源（IS10）。
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公开(公告)号：US10720543B2
公开(公告)日：2020-07-21
申请号：US15751795
申请日：2016-08-28
发明人： Hiroshi Fukuda , Shin Kamei , Ken Tsuzuki , Makoto Jizodo , Kiyofumi Kikuchi
IPC分类号： H01L31/102 , H01L31/105 , H01L31/0224 , H01L31/0352 , H01L31/028 , H01L31/0232 , H01L31/0264
摘要： A germanium photodetector which reduces a dark current without degradation of a photocurrent includes: a silicon substrate; a lower clad layer formed on the silicon substrate; a core layer formed on the lower clad layer; a p-type silicon slab formed in a part of the core layer and doped with a p-type impurity ion; p++ silicon electrode sections that are highly-doped with a p-type impurity and act as an electrode; and germanium layers which absorb light. The germanium photodetector further includes an upper clad layer, an n-type germanium region doped with an n-type impurity above the germanium layer, and an electrode. According to the present invention, two germanium layers are provided on the p-type silicon slab so as to miniaturize the area of the surface of the individual germanium layer in contact with the p-type silicon slab, so that the dark current due to threading dislocation can be reduced.
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公开(公告)号：US20190181961A1
公开(公告)日：2019-06-13
申请号：US16309410
申请日：2017-06-19
发明人： Toshihiro Itoh , Yuriko Kawamura , Kiyofumi Kikuchi , Ken Tsuzuki , Hiroshi Fukuda , Shin Kamei
摘要： An optical receiver is configured so as to be as less susceptible to noise as possible even in the case where high noise occurs inside an optical transceiver. The optical receiver includes a connection part that connects two photodiodes (PDs) constituting a dual photodiode and a transimpedance amplifier (TIA), wherein signal lines from the dual photodiode are surrounded by a conductor pattern that is not connected to each of the signal lines for each channel, and the conductor pattern is connected to a ground pattern on the transimpedance amplifier or a power source pattern for the PDs.
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