-
公开(公告)号:US10649147B2
公开(公告)日:2020-05-12
申请号:US16099955
申请日:2017-05-12
发明人: Tomohiro Nakanishi , Teruaki Sato , Motohaya Ishii , Satoru Konno , Yuichi Suzuki , Shigeo Nagashima , Shinji Mino , Shuichiro Asakawa , Hiroshi Fukuda , Shin Kamei , Shunichi Soma , Ken Tsuzuki , Mitsuo Usui , Takashi Saida
IPC分类号: G02B6/30
摘要: An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
-
公开(公告)号:US20190353844A1
公开(公告)日:2019-11-21
申请号:US16099955
申请日:2017-05-12
发明人: Tomohiro Nakanishi , Teruaki Sato , Motohaya Ishii , Satoru Konno , Yuichi Suzuki , Shigeo Nagashima , Shinji Mino , Shuichiro Asakawa , Hiroshi Fukuda , Shin Kamei , Shunichi Soma , Ken Tsuzuki , Mitsuo Usui , Takashi Saida
IPC分类号: G02B6/30
摘要: An optical module which is connectable to an optical fiber array and which can be packaged in a high density. Two 30 mm square package modules are mounted on a board, and optical waveguides in a 20 mm square Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block (15×10 mm). Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. In the embodiment, the optical waveguides in the Si photonic lightwave circuit are tilted at an appropriate angle, for example, 20 degrees with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted at 20 degrees with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.
-
公开(公告)号:US20220416108A1
公开(公告)日:2022-12-29
申请号:US17777893
申请日:2019-11-20
发明人: Yoshiho Maeda , Tatsuro Hiraki , Hiroshi Fukuda
IPC分类号: H01L31/105 , G02B6/13 , H01L31/0304 , H01L31/18
摘要: A light reception device of the present invention includes a first i-type cladding region, an n-type waveguide core having a predetermined width, and a second i-type cladding region in contact with a side surface of the n-type waveguide core on a substrate, includes a p-type absorption layer, a p-type diffusion barrier layer, a p-type contact layer, and a p-type electrode formed in an upper part above a region including a part of the n-type waveguide core, with an i-type insertion layer interposed between the upper part and the region, and includes an n-type electrode on an upper surface of another part of the n-type waveguide core.
-
公开(公告)号:US11442229B2
公开(公告)日:2022-09-13
申请号:US15734904
申请日:2019-05-16
发明人: Toru Miura , Yoshiho Maeda , Hiroshi Fukuda
摘要: An optical waveguide in which a grating coupler is formed, a first pattern region arranged to surround the grating coupler, and a second pattern region arranged to surround the grating coupler are included. The first pattern region and the second pattern region are arranged adjacently. In a periphery of the grating coupler, the first pattern region is formed in a region continuous in a circumferential direction. Similarly, in the periphery of the grating coupler, the second pattern region is formed in a region continuous in the circumferential direction.
-
公开(公告)号:US11415752B2
公开(公告)日:2022-08-16
申请号:US17057057
申请日:2019-05-14
发明人: Hiroshi Fukuda , Toru Miura , Yoshiho Maeda
摘要: An optical inspection circuit includes an optical circuit to be inspected formed on a substrate, an input optical waveguide optically connected to the optical circuit, and an output optical waveguide optically connected to the optical circuit. The input optical waveguide is connected with a grating coupler for input. The grating coupler is connected with the input optical waveguide via a spot size conversion unit. The output optical waveguide is optically connected with a photodiode.
-
公开(公告)号:US20220229317A1
公开(公告)日:2022-07-21
申请号:US17609092
申请日:2019-05-23
发明人: Hiroshi Fukuda , Toru Miura , Yoshiho Maeda
摘要: In an embodiment, an optical inspection circuit includes: an optical modulator comprising an optical waveguide on a substrate, the optical waveguide having a core comprising a semiconductor; a first input waveguide optically connected to the optical modulator, the first input waveguide having a core comprising the semiconductor; an output waveguide optically connected to the optical modulator, the output waveguide having a core comprising the semiconductor; a photodiode on the substrate in a vicinity of the optical modulator; a wire electrically connecting the optical modulator and the photodiode; and a second input waveguide optically connected to the photodiode, the second input waveguide having a core comprising the semiconductor.
-
公开(公告)号:US10601522B2
公开(公告)日:2020-03-24
申请号:US16309410
申请日:2017-06-19
发明人: Toshihiro Itoh , Yuriko Kawamura , Kiyofumi Kikuchi , Ken Tsuzuki , Hiroshi Fukuda , Shin Kamei
摘要: An optical receiver is configured so as to be as less susceptible to noise as possible even in the case where high noise occurs inside an optical transceiver. The optical receiver includes a connection part that connects two photodiodes (PDs) constituting a dual photodiode and a transimpedance amplifier (TIA), wherein signal lines from the dual photodiode are surrounded by a conductor pattern that is not connected to each of the signal lines for each channel, and the conductor pattern is connected to a ground pattern on the transimpedance amplifier or a power source pattern for the PDs.
-
公开(公告)号:US10295744B2
公开(公告)日:2019-05-21
申请号:US15568610
申请日:2016-05-27
发明人: Shin Kamei , Makoto Jizodo , Hiroshi Fukuda , Kiyofumi Kikuchi , Ken Tsuzuki
摘要: A coherent optical mixer circuit is provided that can measure a phase error without requiring a step of cutting away a delay circuit. Odd-numbered or even-numbered two of four inputs of an 4-input-and-4-output multimode interference circuit are connected to an input mechanism. The four outputs of the multimode interference circuit are all connected to an output mechanism to the exterior. Other two inputs of the multimode interference circuit are connected to two monitor waveguides. One of the monitor waveguide is longer than the other to configure a light delay circuit. The monitor waveguides constituting the light delay circuit are connected to the respective outputs of a 2-branched light splitter. The 2-branched light splitter has an input connected to a monitor light input mechanism from the exterior via a monitor input waveguide.
-
公开(公告)号:US11815422B2
公开(公告)日:2023-11-14
申请号:US17418720
申请日:2019-12-13
发明人: Hiroshi Fukuda , Toru Miura , Yoshiho Maeda
IPC分类号: G01M11/00 , G02B6/12 , H01L31/0232 , H01L31/028 , H01L33/34
CPC分类号: G01M11/33 , G02B6/12007 , H01L31/028 , H01L31/02327 , H01L33/34 , G02B2006/12061 , G02B2006/12123 , G02B2006/12126
摘要: An embodiment optical test circuit includes a first optical circuit and a second optical circuit formed on a substrate, an input optical waveguide optically connected to the first optical circuit and the second optical circuit, and an output optical waveguide optically connected to the first optical circuit and the second optical circuit. The optical test circuit also includes a light emitting diode optically connected to the input optical waveguide, and a photodiode optically connected to the output optical waveguide.
-
公开(公告)号:US20220357532A1
公开(公告)日:2022-11-10
申请号:US17619891
申请日:2019-06-17
发明人: Yoshiho Maeda , Toru Miura , Hiroshi Fukuda
摘要: An embodiment optical circuit wafer includes a plurality of unit sections formed on a wafer. The plurality of unit sections are formed in each of first dies, second dies, and third dies. Further, each of the plurality of unit sections includes electrical pads formed in a common layout. Further, each of the plurality of unit sections includes optical input/output ports formed in a common layout. The input/output ports are, for example, grating couplers. Further, each of the plurality of unit sections includes optical circuits. The optical circuits have different circuit structures from one another.
-
-
-
-
-
-
-
-
-